EP3C25F256I7N vs EP3C16F256I7N Ikinahambing
Detalyadong pagkakahiwalay na pagkakahambing ng EP3C25F256I7N sa pamamagitan ng Intel at EP3C16F256I7N sa pamamagitan ng Intel. Ikinahambing ang mga pangunahing paglalarawan, mga tama ng elektriko, paakay, kalagayan ng buhay, presyo, at pagkakaroon upang makita ang pinakamahusay na komponente para sa iyong mga kinakailangang pang disenyo.
Pagsanggunian na paghahambing
| Parametro | EP3C25F256I7N | EP3C16F256I7N |
|---|---|---|
| Brand | Intel | Intel |
| Kategorya | FPGA & CPLD | FPGA & CPLD |
| Katayuan ng Lifecycle | Aktibo | Aktibo |
| Device Type | FPGA | — |
| Family | Cyclone III | Cyclone III |
| Logic Elements | 24,624 | — |
| Embedded Memory | 608,256 bits | 56 M9K blocks (504 Kbit) |
| Embedded Multipliers | 66 (18x18) | — |
| Maximum User I/O | 156 | — |
| Core Supply Voltage | 1.2 V | — |
| Packhaging | 256-FBGA (FineLine BGA) | 256-ball FBGA (17 mm x 17 mm, 1.0 mm pitch) |
| Temperature na Operasyon | -40C to +125C | -40C to +100C (industrial, I7) |
| Speed Grade | 7 | — |
| Process Technology | 65 nm low-power | TSMC 60 nm low-leakage |
| PLLs | 4 general-purpose PLLs | 4 |
| External Memory Support | DDR/DDR2/QDRII/QDRII+ | — |
| Uri ng Pagpapasok | Surface Mount | — |
| Tindminan RoHS | Compliant (lead-free) | — |
| Hot Socketing | Supported | — |
| Configuration | SRAM-based, in-system programmable | SRAM-based, requires external config device (EPCS/EPCQ) |
| Logic Elements (LEs) | — | 15408 |
| Logic Array Blocks (LABs) | — | 963 |
| Total Memory Bits | — | 516096 |
| Embedded 18x18 Multipliers | — | 56 |
| Maximum User I/O Pins | — | 168 |
| Supply Voltage (Core) | — | 1.2 V typical |
| Lead-Free / Pb-Free | — | Yes (N suffix per JEDEC JESD97) |
| RoHS Compliance | — | Compliant |