EP3C25F256I7N vs EP3C16F256I7N Perbandingan
Perbandingan bersamaan detil EP3C25F256I7N dari Intel dan EP3C16F256I7N dari Intel. Bandingkan spesifikasi penting, parameter listrik, pengemasan, status cycle, harga, dan ketersediaan untuk menentukan komponen terbaik untuk kebutuhan desain Anda.
Perbandingan Spesifikasi
| Parameter Umum | EP3C25F256I7N | EP3C16F256I7N |
|---|---|---|
| Merek | Intel | Intel |
| Kategori | FPGA & CPLD | FPGA & CPLD |
| Status Lingkungan Hidup | Aktif | Aktif |
| Device Type | FPGA | — |
| Family | Cyclone III | Cyclone III |
| Logic Elements | 24,624 | — |
| Embedded Memory | 608,256 bits | 56 M9K blocks (504 Kbit) |
| Embedded Multipliers | 66 (18x18) | — |
| Maximum User I/O | 156 | — |
| Core Supply Voltage | 1.2 V | — |
| Paket | 256-FBGA (FineLine BGA) | 256-ball FBGA (17 mm x 17 mm, 1.0 mm pitch) |
| Suhu Kerja | -40C to +125C | -40C to +100C (industrial, I7) |
| Speed Grade | 7 | — |
| Process Technology | 65 nm low-power | TSMC 60 nm low-leakage |
| PLLs | 4 general-purpose PLLs | 4 |
| External Memory Support | DDR/DDR2/QDRII/QDRII+ | — |
| Tipe Mounting | Surface Mount | — |
| Status RoHS | Compliant (lead-free) | — |
| Hot Socketing | Supported | — |
| Configuration | SRAM-based, in-system programmable | SRAM-based, requires external config device (EPCS/EPCQ) |
| Logic Elements (LEs) | — | 15408 |
| Logic Array Blocks (LABs) | — | 963 |
| Total Memory Bits | — | 516096 |
| Embedded 18x18 Multipliers | — | 56 |
| Maximum User I/O Pins | — | 168 |
| Supply Voltage (Core) | — | 1.2 V typical |
| Lead-Free / Pb-Free | — | Yes (N suffix per JEDEC JESD97) |
| RoHS Compliance | — | Compliant |