EP3C25F256I7N vs EP3C25F324C7N Comparison
Detailed side-by-side comparison of EP3C25F256I7N by Intel and EP3C25F324C7N by Intel. Compare key specifications, electrical parameters, packaging, lifecycle status, pricing, and availability to determine the best component for your design requirements.
Specification Comparison
| Parameter | EP3C25F256I7N | EP3C25F324C7N |
|---|---|---|
| Brand | Intel | Intel |
| Category | FPGA & CPLD | FPGA & CPLD |
| Lifecycle Status | Active | Active |
| Device Type | FPGA | — |
| Family | Cyclone III | — |
| Logic Elements | 24,624 | — |
| Embedded Memory | 608,256 bits | 608,256 bits |
| Embedded Multipliers | 66 (18x18) | — |
| Maximum User I/O | 156 | — |
| Core Supply Voltage | 1.2 V | — |
| Package | 256-FBGA (FineLine BGA) | 324-ball FBGA |
| Operating Temperature | -40C to +125C | — |
| Speed Grade | 7 | — |
| Process Technology | 65 nm low-power | 65 nm |
| PLLs | 4 general-purpose PLLs | — |
| External Memory Support | DDR/DDR2/QDRII/QDRII+ | — |
| Mounting Type | Surface Mount | Surface Mount |
| RoHS Status | Compliant (lead-free) | [DATA_NEEDED: RoHS status] |
| Hot Socketing | Supported | — |
| Configuration | SRAM-based, in-system programmable | — |
| Product Type | — | Field Programmable Gate Array (FPGA) |
| Device Family | — | Cyclone III |
| Logic Cells | — | 24,624 cells |
| Available I/O Pins | — | 215 I/O |
| Maximum Listed Frequency | — | 437.5 MHz |
| Core Voltage | — | 1.2 V |
| Terminal Count | — | 324 terminals |
| Terminal Form | — | Ball |
| Package Code | — | BGA |
| Package Shape | — | Rectangular |
| Temperature Grading | — | Other |
| Programmability | — | Field programmable |
| REACH Status | — | [DATA_NEEDED: REACH status] |
| AEC-Q100 Qualification | — | [DATA_NEEDED: AEC-Q100 qualification] |