EP3C25F256I7N vs EP3C25F324C7N Perbandingan
Perbandingan bersamaan detil EP3C25F256I7N dari Intel dan EP3C25F324C7N dari Intel. Bandingkan spesifikasi penting, parameter listrik, pengemasan, status cycle, harga, dan ketersediaan untuk menentukan komponen terbaik untuk kebutuhan desain Anda.
Perbandingan Spesifikasi
| Parameter Umum | EP3C25F256I7N | EP3C25F324C7N |
|---|---|---|
| Merek | Intel | Intel |
| Kategori | FPGA & CPLD | FPGA & CPLD |
| Status Lingkungan Hidup | Aktif | Aktif |
| Device Type | FPGA | — |
| Family | Cyclone III | — |
| Logic Elements | 24,624 | — |
| Embedded Memory | 608,256 bits | 608,256 bits |
| Embedded Multipliers | 66 (18x18) | — |
| Maximum User I/O | 156 | — |
| Core Supply Voltage | 1.2 V | — |
| Paket | 256-FBGA (FineLine BGA) | 324-ball FBGA |
| Suhu Kerja | -40C to +125C | — |
| Speed Grade | 7 | — |
| Process Technology | 65 nm low-power | 65 nm |
| PLLs | 4 general-purpose PLLs | — |
| External Memory Support | DDR/DDR2/QDRII/QDRII+ | — |
| Tipe Mounting | Surface Mount | Surface Mount |
| Status RoHS | Compliant (lead-free) | [DATA_NEEDED: RoHS status] |
| Hot Socketing | Supported | — |
| Configuration | SRAM-based, in-system programmable | — |
| Product Type | — | Field Programmable Gate Array (FPGA) |
| Device Family | — | Cyclone III |
| Logic Cells | — | 24,624 cells |
| Available I/O Pins | — | 215 I/O |
| Maximum Listed Frequency | — | 437.5 MHz |
| Core Voltage | — | 1.2 V |
| Terminal Count | — | 324 terminals |
| Terminal Form | — | Ball |
| Package Code | — | BGA |
| Package Shape | — | Rectangular |
| Temperature Grading | — | Other |
| Programmability | — | Field programmable |
| REACH Status | — | [DATA_NEEDED: REACH status] |
| AEC-Q100 Qualification | — | [DATA_NEEDED: AEC-Q100 qualification] |