EP3C25F256I7N vs EP3C25F324C7N Vergleich
Detaillierter Direktvergleich von EP3C25F256I7N von Intel und EP3C25F324C7N von Intel. Vergleichen Sie die wichtigsten Spezifikationen, elektrischen Parameter, Gehäuse, Lebenszyklusstatus, Preise und Verfügbarkeit, um das beste Bauteil für Ihre Designanforderungen zu ermitteln.
Spezifikationsvergleich
| Parameter | EP3C25F256I7N | EP3C25F324C7N |
|---|---|---|
| Marke | Intel | Intel |
| Kategorie | FPGA & CPLD | FPGA & CPLD |
| Lebenszyklusstatus | Aktiv | Aktiv |
| Lagerstatus | In Stock | In Stock |
| Stückpreis (USD) | $27,20 | $0,00 |
| Device Type | FPGA | — |
| Family | Cyclone III | — |
| Logic Elements | 24,624 | — |
| Embedded Memory | 608,256 bits | 608,256 bits |
| Embedded Multipliers | 66 (18x18) | — |
| Maximum User I/O | 156 | — |
| Core Supply Voltage | 1.2 V | — |
| Gehäuse | 256-FBGA (FineLine BGA) | 324-ball FBGA |
| Betriebstemperatur | -40C to +125C | — |
| Speed Grade | 7 | — |
| Process Technology | 65 nm low-power | 65 nm |
| PLLs | 4 general-purpose PLLs | — |
| External Memory Support | DDR/DDR2/QDRII/QDRII+ | — |
| Montageart | Surface Mount | Surface Mount |
| RoHS-Status | Compliant (lead-free) | [DATA_NEEDED: RoHS status] |
| Hot Socketing | Supported | — |
| Configuration | SRAM-based, in-system programmable | — |
| Product Type | — | Field Programmable Gate Array (FPGA) |
| Device Family | — | Cyclone III |
| Logic Cells | — | 24,624 cells |
| Available I/O Pins | — | 215 I/O |
| Maximum Listed Frequency | — | 437.5 MHz |
| Core Voltage | — | 1.2 V |
| Terminal Count | — | 324 terminals |
| Terminal Form | — | Ball |
| Package Code | — | BGA |
| Package Shape | — | Rectangular |
| Temperature Grading | — | Other |
| Programmability | — | Field programmable |
| REACH Status | — | [DATA_NEEDED: REACH status] |
| AEC-Q100 Qualification | — | [DATA_NEEDED: AEC-Q100 qualification] |