EP3C25F324C7 vs EP3C25F324C6N Comparison

Detailed side-by-side comparison of EP3C25F324C7 by Intel and EP3C25F324C6N by Intel. Compare key specifications, electrical parameters, packaging, lifecycle status, pricing, and availability to determine the best component for your design requirements.

Specification Comparison

Parameter EP3C25F324C7 EP3C25F324C6N
Brand Intel Intel
Category FPGA & CPLD FPGA & CPLD
Lifecycle Status Active Active
Device Type Field Programmable Gate Array (FPGA) —
FPGA Family Cyclone III —
Logic Elements 24,624 —
Memory Bits 608,256 bits —
Number of I/O 215 —
Package Type 324-BGA —
Package Code BGA —
Number of Terminals 324 —
Package Shape Square —
Terminal Form Ball —
Mounting Type Surface Mount Surface Mount
Operating Voltage Range [DATA_NEEDED: operating voltage range] —
Maximum Operating Frequency [DATA_NEEDED: maximum operating frequency] —
Operating Temperature Range [DATA_NEEDED: operating temperature range] —
Internal Memory Configuration [DATA_NEEDED: internal memory configuration] —
I/O Standard [DATA_NEEDED: supported I/O standards] —
RoHS Compliance [DATA_NEEDED: RoHS compliance] —
REACH Compliance [DATA_NEEDED: REACH compliance] —
Lead-Free Status [DATA_NEEDED: lead-free status] —
Series — Cyclone III
Family — Cyclone III (low-power, low-cost FPGA)
Logic Elements (LE) — 24,624
Total Memory Bits — 608,256 bits
Embedded Memory Blocks — M9K blocks, 66 total
Embedded Multipliers — 66 (18x18)
DSP Blocks — 66 dedicated 18x18 multipliers
User I/O Pins — 215
Number of I/O Banks — 8
PLLs — 4 general-purpose PLLs
Package — 324-BGA (FBGA-324), fine-pitch
Speed Grade — C6 (commercial)
Operating Temperature — 0C to +85C (commercial)
Process Technology — TSMC 65 nm low-power (LP)
Configuration Schemes — Passive Serial, Fast Passive Parallel, JTAG
Lead-Free / RoHS — Yes (lead-free, RoHS compliant)

Datasheets & Resources

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