EP3C25F324C7 vs EP3C25F324C6N Comparação

Comparação detalhada lado a lado de EP3C25F324C7 por Intel e EP3C25F324C6N por Intel. Compare especificações principais, parâmetros elétricos, encapsulamento, status do ciclo de vida, preços e disponibilidade para determinar o melhor componente para os requisitos do seu projeto.

Comparação de especificações

Parâmetro EP3C25F324C7 EP3C25F324C6N
Marca Intel Intel
Categoria FPGA & CPLD FPGA & CPLD
Status do ciclo de vida Ativo Ativo
Device Type Field Programmable Gate Array (FPGA) —
FPGA Family Cyclone III —
Logic Elements 24,624 —
Memory Bits 608,256 bits —
Number of I/O 215 —
Package Type 324-BGA —
Package Code BGA —
Number of Terminals 324 —
Package Shape Square —
Terminal Form Ball —
Tipo de montagem Surface Mount Surface Mount
Operating Voltage Range [DATA_NEEDED: operating voltage range] —
Maximum Operating Frequency [DATA_NEEDED: maximum operating frequency] —
Faixa de temperatura de operação [DATA_NEEDED: operating temperature range] —
Internal Memory Configuration [DATA_NEEDED: internal memory configuration] —
I/O Standard [DATA_NEEDED: supported I/O standards] —
RoHS Compliance [DATA_NEEDED: RoHS compliance] —
REACH Compliance [DATA_NEEDED: REACH compliance] —
Lead-Free Status [DATA_NEEDED: lead-free status] —
Series — Cyclone III
Family — Cyclone III (low-power, low-cost FPGA)
Logic Elements (LE) — 24,624
Total Memory Bits — 608,256 bits
Embedded Memory Blocks — M9K blocks, 66 total
Embedded Multipliers — 66 (18x18)
DSP Blocks — 66 dedicated 18x18 multipliers
User I/O Pins — 215
Number of I/O Banks — 8
PLLs — 4 general-purpose PLLs
Encapsulamento — 324-BGA (FBGA-324), fine-pitch
Speed Grade — C6 (commercial)
Temperatura de operação — 0C to +85C (commercial)
Process Technology — TSMC 65 nm low-power (LP)
Configuration Schemes — Passive Serial, Fast Passive Parallel, JTAG
Lead-Free / RoHS — Yes (lead-free, RoHS compliant)

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