EP3C25F324C7 vs EP3C25F324C6N Comparación
Comparación detallada lado a lado de EP3C25F324C7 por Intel y EP3C25F324C6N por Intel. Compare las especificaciones clave, los parámetros eléctricos, el encapsulado, el estado del ciclo de vida, los precios y la disponibilidad para determinar el mejor componente para los requisitos de su diseño.
Comparación de especificaciones
| Parámetro | EP3C25F324C7 | EP3C25F324C6N |
|---|---|---|
| Marca | Intel | Intel |
| Categoría | FPGA & CPLD | FPGA & CPLD |
| Estado del ciclo de vida | Activo | Activo |
| Device Type | Field Programmable Gate Array (FPGA) | — |
| FPGA Family | Cyclone III | — |
| Logic Elements | 24,624 | — |
| Memory Bits | 608,256 bits | — |
| Number of I/O | 215 | — |
| Package Type | 324-BGA | — |
| Package Code | BGA | — |
| Number of Terminals | 324 | — |
| Package Shape | Square | — |
| Terminal Form | Ball | — |
| Tipo de montaje | Surface Mount | Surface Mount |
| Operating Voltage Range | [DATA_NEEDED: operating voltage range] | — |
| Maximum Operating Frequency | [DATA_NEEDED: maximum operating frequency] | — |
| Rango de temperatura de funcionamiento | [DATA_NEEDED: operating temperature range] | — |
| Internal Memory Configuration | [DATA_NEEDED: internal memory configuration] | — |
| I/O Standard | [DATA_NEEDED: supported I/O standards] | — |
| RoHS Compliance | [DATA_NEEDED: RoHS compliance] | — |
| REACH Compliance | [DATA_NEEDED: REACH compliance] | — |
| Lead-Free Status | [DATA_NEEDED: lead-free status] | — |
| Series | — | Cyclone III |
| Family | — | Cyclone III (low-power, low-cost FPGA) |
| Logic Elements (LE) | — | 24,624 |
| Total Memory Bits | — | 608,256 bits |
| Embedded Memory Blocks | — | M9K blocks, 66 total |
| Embedded Multipliers | — | 66 (18x18) |
| DSP Blocks | — | 66 dedicated 18x18 multipliers |
| User I/O Pins | — | 215 |
| Number of I/O Banks | — | 8 |
| PLLs | — | 4 general-purpose PLLs |
| Encapsulado | — | 324-BGA (FBGA-324), fine-pitch |
| Speed Grade | — | C6 (commercial) |
| Temperatura de funcionamiento | — | 0C to +85C (commercial) |
| Process Technology | — | TSMC 65 nm low-power (LP) |
| Configuration Schemes | — | Passive Serial, Fast Passive Parallel, JTAG |
| Lead-Free / RoHS | — | Yes (lead-free, RoHS compliant) |