EP3C25F324C7 vs EP3C25F324C6N Karşılaştırma

Ayrıntılı yan yana karşılaştırma EP3C25F324C7 tarafından Intel ve EP3C25F324C6N tarafından IntelAnahtar özellikleri, elektriksel parametreleri, ambalajı, yaşam döngüsü durumu, fiyatlandırma ve mevcudiyeti karşılaştırarak tasarım gereksinimleriniz için en iyi bileşeni belirleyin.

Özellik Karşılaştırması

Parametre EP3C25F324C7 EP3C25F324C6N
Marka Intel Intel
Kategori FPGA & CPLD FPGA & CPLD
Yaşam Döngüsü Durumu Aktif Aktif
Device Type Field Programmable Gate Array (FPGA) —
FPGA Family Cyclone III —
Logic Elements 24,624 —
Memory Bits 608,256 bits —
Number of I/O 215 —
Package Type 324-BGA —
Package Code BGA —
Number of Terminals 324 —
Package Shape Square —
Terminal Form Ball —
Montaj Türü Surface Mount Surface Mount
Operating Voltage Range [DATA_NEEDED: operating voltage range] —
Maximum Operating Frequency [DATA_NEEDED: maximum operating frequency] —
İşletim Sıcaklığı Aralığı [DATA_NEEDED: operating temperature range] —
Internal Memory Configuration [DATA_NEEDED: internal memory configuration] —
I/O Standard [DATA_NEEDED: supported I/O standards] —
RoHS Compliance [DATA_NEEDED: RoHS compliance] —
REACH Compliance [DATA_NEEDED: REACH compliance] —
Lead-Free Status [DATA_NEEDED: lead-free status] —
Series — Cyclone III
Family — Cyclone III (low-power, low-cost FPGA)
Logic Elements (LE) — 24,624
Total Memory Bits — 608,256 bits
Embedded Memory Blocks — M9K blocks, 66 total
Embedded Multipliers — 66 (18x18)
DSP Blocks — 66 dedicated 18x18 multipliers
User I/O Pins — 215
Number of I/O Banks — 8
PLLs — 4 general-purpose PLLs
Paket — 324-BGA (FBGA-324), fine-pitch
Speed Grade — C6 (commercial)
İşletim Sıcaklığı — 0C to +85C (commercial)
Process Technology — TSMC 65 nm low-power (LP)
Configuration Schemes — Passive Serial, Fast Passive Parallel, JTAG
Lead-Free / RoHS — Yes (lead-free, RoHS compliant)

Dökümanlar & Kaynaklar

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