EP3C25F324C7 vs EP3C25F324C8N Comparison

Detailed side-by-side comparison of EP3C25F324C7 by Intel and EP3C25F324C8N by Intel. Compare key specifications, electrical parameters, packaging, lifecycle status, pricing, and availability to determine the best component for your design requirements.

Specification Comparison

Parameter EP3C25F324C7 EP3C25F324C8N
Brand Intel Intel
Category FPGA & CPLD FPGA & CPLD
Lifecycle Status Active Active
Device Type Field Programmable Gate Array (FPGA) —
FPGA Family Cyclone III —
Logic Elements 24,624 —
Memory Bits 608,256 bits —
Number of I/O 215 215
Package Type 324-BGA —
Package Code BGA —
Number of Terminals 324 —
Package Shape Square —
Terminal Form Ball —
Mounting Type Surface Mount Surface Mount
Operating Voltage Range [DATA_NEEDED: operating voltage range] —
Maximum Operating Frequency [DATA_NEEDED: maximum operating frequency] —
Operating Temperature Range [DATA_NEEDED: operating temperature range] —
Internal Memory Configuration [DATA_NEEDED: internal memory configuration] —
I/O Standard [DATA_NEEDED: supported I/O standards] —
RoHS Compliance [DATA_NEEDED: RoHS compliance] —
REACH Compliance [DATA_NEEDED: REACH compliance] —
Lead-Free Status [DATA_NEEDED: lead-free status] —
Family — Cyclone III
Series — Cyclone III
Logic Elements (LEs) — 24,624
Total Memory Bits — 608,256 bits
Embedded Memory (Kbits) — 608 Kbits
Package — 324-BGA (FineLine)
Supply Voltage - Core — 1.2 V
Operating Temperature — 0 C to +85 C (commercial, suffix C)
Speed Grade — 8
Total RAM Bits — 608,256
Process Node — 60 nm low-power CMOS
Number of Multipliers (18x18) — 66
Number of PLLs — 4
RoHS Status — Compliant

Datasheets & Resources

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