EP3C25F324C7 vs EP3C25F324C8N Comparaison
Comparaison détaillée côte à côte de EP3C25F324C7 par Intel et EP3C25F324C8N par Intel. Comparez les spécifications clés, les paramètres électriques, le conditionnement, le statut de cycle de vie, les prix et la disponibilité pour déterminer le meilleur composant pour vos exigences de conception.
Comparaison des spécifications
| Paramètre | EP3C25F324C7 | EP3C25F324C8N |
|---|---|---|
| Marque | Intel | Intel |
| Catégorie | FPGA & CPLD | FPGA & CPLD |
| Statut du cycle de vie | Actif | Actif |
| Device Type | Field Programmable Gate Array (FPGA) | — |
| FPGA Family | Cyclone III | — |
| Logic Elements | 24,624 | — |
| Memory Bits | 608,256 bits | — |
| Number of I/O | 215 | 215 |
| Package Type | 324-BGA | — |
| Package Code | BGA | — |
| Number of Terminals | 324 | — |
| Package Shape | Square | — |
| Terminal Form | Ball | — |
| Type de montage | Surface Mount | Surface Mount |
| Operating Voltage Range | [DATA_NEEDED: operating voltage range] | — |
| Maximum Operating Frequency | [DATA_NEEDED: maximum operating frequency] | — |
| Plage de température de fonctionnement | [DATA_NEEDED: operating temperature range] | — |
| Internal Memory Configuration | [DATA_NEEDED: internal memory configuration] | — |
| I/O Standard | [DATA_NEEDED: supported I/O standards] | — |
| RoHS Compliance | [DATA_NEEDED: RoHS compliance] | — |
| REACH Compliance | [DATA_NEEDED: REACH compliance] | — |
| Lead-Free Status | [DATA_NEEDED: lead-free status] | — |
| Family | — | Cyclone III |
| Series | — | Cyclone III |
| Logic Elements (LEs) | — | 24,624 |
| Total Memory Bits | — | 608,256 bits |
| Embedded Memory (Kbits) | — | 608 Kbits |
| Boîtier | — | 324-BGA (FineLine) |
| Supply Voltage - Core | — | 1.2 V |
| Température de fonctionnement | — | 0 C to +85 C (commercial, suffix C) |
| Speed Grade | — | 8 |
| Total RAM Bits | — | 608,256 |
| Process Node | — | 60 nm low-power CMOS |
| Number of Multipliers (18x18) | — | 66 |
| Number of PLLs | — | 4 |
| Statut RoHS | — | Compliant |