EP3C25F324C7 vs EP3C25F324C8N Comparación
Comparación detallada lado a lado de EP3C25F324C7 por Intel y EP3C25F324C8N por Intel. Compare las especificaciones clave, los parámetros eléctricos, el encapsulado, el estado del ciclo de vida, los precios y la disponibilidad para determinar el mejor componente para los requisitos de su diseño.
Comparación de especificaciones
| Parámetro | EP3C25F324C7 | EP3C25F324C8N |
|---|---|---|
| Marca | Intel | Intel |
| Categoría | FPGA & CPLD | FPGA & CPLD |
| Estado del ciclo de vida | Activo | Activo |
| Device Type | Field Programmable Gate Array (FPGA) | — |
| FPGA Family | Cyclone III | — |
| Logic Elements | 24,624 | — |
| Memory Bits | 608,256 bits | — |
| Number of I/O | 215 | 215 |
| Package Type | 324-BGA | — |
| Package Code | BGA | — |
| Number of Terminals | 324 | — |
| Package Shape | Square | — |
| Terminal Form | Ball | — |
| Tipo de montaje | Surface Mount | Surface Mount |
| Operating Voltage Range | [DATA_NEEDED: operating voltage range] | — |
| Maximum Operating Frequency | [DATA_NEEDED: maximum operating frequency] | — |
| Rango de temperatura de funcionamiento | [DATA_NEEDED: operating temperature range] | — |
| Internal Memory Configuration | [DATA_NEEDED: internal memory configuration] | — |
| I/O Standard | [DATA_NEEDED: supported I/O standards] | — |
| RoHS Compliance | [DATA_NEEDED: RoHS compliance] | — |
| REACH Compliance | [DATA_NEEDED: REACH compliance] | — |
| Lead-Free Status | [DATA_NEEDED: lead-free status] | — |
| Family | — | Cyclone III |
| Series | — | Cyclone III |
| Logic Elements (LEs) | — | 24,624 |
| Total Memory Bits | — | 608,256 bits |
| Embedded Memory (Kbits) | — | 608 Kbits |
| Encapsulado | — | 324-BGA (FineLine) |
| Supply Voltage - Core | — | 1.2 V |
| Temperatura de funcionamiento | — | 0 C to +85 C (commercial, suffix C) |
| Speed Grade | — | 8 |
| Total RAM Bits | — | 608,256 |
| Process Node | — | 60 nm low-power CMOS |
| Number of Multipliers (18x18) | — | 66 |
| Number of PLLs | — | 4 |
| Estado RoHS | — | Compliant |