EP3C25F324C7 vs EP3C25F324C8N 对比

详细并排对比 EP3C25F324C7 出自 Intel 和 EP3C25F324C8N 出自 Intel。对比关键规格、电气参数、封装、生命周期状态、价格和供货情况,以确定最适合您设计需求的元器件。

规格对比

参数 EP3C25F324C7 EP3C25F324C8N
品牌 Intel Intel
分类 FPGA & CPLD FPGA & CPLD
生命周期状态 有效 有效
Device Type Field Programmable Gate Array (FPGA) —
FPGA Family Cyclone III —
Logic Elements 24,624 —
Memory Bits 608,256 bits —
Number of I/O 215 215
Package Type 324-BGA —
Package Code BGA —
Number of Terminals 324 —
Package Shape Square —
Terminal Form Ball —
安装类型 Surface Mount Surface Mount
Operating Voltage Range [DATA_NEEDED: operating voltage range] —
Maximum Operating Frequency [DATA_NEEDED: maximum operating frequency] —
工作温度范围 [DATA_NEEDED: operating temperature range] —
Internal Memory Configuration [DATA_NEEDED: internal memory configuration] —
I/O Standard [DATA_NEEDED: supported I/O standards] —
RoHS Compliance [DATA_NEEDED: RoHS compliance] —
REACH Compliance [DATA_NEEDED: REACH compliance] —
Lead-Free Status [DATA_NEEDED: lead-free status] —
Family — Cyclone III
Series — Cyclone III
Logic Elements (LEs) — 24,624
Total Memory Bits — 608,256 bits
Embedded Memory (Kbits) — 608 Kbits
封装 — 324-BGA (FineLine)
Supply Voltage - Core — 1.2 V
工作温度 — 0 C to +85 C (commercial, suffix C)
Speed Grade — 8
Total RAM Bits — 608,256
Process Node — 60 nm low-power CMOS
Number of Multipliers (18x18) — 66
Number of PLLs — 4
RoHS 状态 — Compliant

数据手册与资源

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