EP3C25F324C7 vs EP3C25F324C8N 比較

詳細並排比較 EP3C25F324C7 由 Intel 與 EP3C25F324C8N 由 Intel. 比較關鍵規格、電氣參數、封裝、生命週期狀態、價格與供貨情況,以找出最符合您設計需求的元件。

規格比較

參數 EP3C25F324C7 EP3C25F324C8N
品牌 Intel Intel
類別 FPGA & CPLD FPGA & CPLD
生命週期狀態 啟用中 啟用中
Device Type Field Programmable Gate Array (FPGA) —
FPGA Family Cyclone III —
Logic Elements 24,624 —
Memory Bits 608,256 bits —
Number of I/O 215 215
Package Type 324-BGA —
Package Code BGA —
Number of Terminals 324 —
Package Shape Square —
Terminal Form Ball —
安裝類型 Surface Mount Surface Mount
Operating Voltage Range [DATA_NEEDED: operating voltage range] —
Maximum Operating Frequency [DATA_NEEDED: maximum operating frequency] —
工作溫度範圍 [DATA_NEEDED: operating temperature range] —
Internal Memory Configuration [DATA_NEEDED: internal memory configuration] —
I/O Standard [DATA_NEEDED: supported I/O standards] —
RoHS Compliance [DATA_NEEDED: RoHS compliance] —
REACH Compliance [DATA_NEEDED: REACH compliance] —
Lead-Free Status [DATA_NEEDED: lead-free status] —
Family — Cyclone III
Series — Cyclone III
Logic Elements (LEs) — 24,624
Total Memory Bits — 608,256 bits
Embedded Memory (Kbits) — 608 Kbits
封裝 — 324-BGA (FineLine)
Supply Voltage - Core — 1.2 V
工作溫度 — 0 C to +85 C (commercial, suffix C)
Speed Grade — 8
Total RAM Bits — 608,256
Process Node — 60 nm low-power CMOS
Number of Multipliers (18x18) — 66
Number of PLLs — 4
RoHS 狀態 — Compliant

資料表與資源

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