EP3C25F324C8 vs EP3C25F324I7 Comparison
Detailed side-by-side comparison of EP3C25F324C8 by Intel and EP3C25F324I7 by Intel. Compare key specifications, electrical parameters, packaging, lifecycle status, pricing, and availability to determine the best component for your design requirements.
Specification Comparison
| Parameter | EP3C25F324C8 | EP3C25F324I7 |
|---|---|---|
| Brand | Intel | Intel |
| Category | FPGA & CPLD | FPGA & CPLD |
| Lifecycle Status | Nrnd | Nrnd |
| Stock Status | In Stock | In Stock |
| Unit Price (USD) | $23.10 | $64.80 |
| Series | Cyclone III | Cyclone III |
| Logic Elements | 24,624 LE | β |
| Logic Array Blocks | 1,539 LABs | β |
| Embedded Memory | 608,256 bits | 608,256 bits (594 Kbits M9K blocks) |
| Embedded Multipliers | 66 (18 x 18) | β |
| User I/Os | 215 | β |
| PLLs | 4 | 4 |
| Process Technology | 65 nm CMOS, SRAM-based | TSMC 65 nm low-power CMOS |
| Core Voltage | 1.2 V | β |
| Speed Grade | 8 (commercial) | β |
| Operating Temperature | 0 Β°C to +85 Β°C (commercial) | β |
| Package | 324-ball FBGA (FineLine BGA), 19 x 19 mm, 1.0 mm pitch | 324-ball FBGA (FineLine BGA), 19 x 19 mm, 1.0 mm pitch |
| Mounting Type | Surface Mount (BGA) | Surface Mount |
| Maximum Internal Clock | 402 MHz | β |
| RoHS Status | Non-compliant (per Lisleapex listing; original part number without 'N' suffix) | Compliant |
| Logic Elements (LEs) | β | 24,624 |
| Logic Array Blocks (LABs) | β | 1,539 |
| Embedded 18x18 Multipliers | β | 66 |
| Global Clock Networks | β | 20 |
| Maximum User I/O | β | 215 |
| Core Voltage (VCCINT) | β | 1.2 V |
| I/O Voltage (VCCIO) | β | 1.2 V to 3.3 V (per bank) |
| Operating Junction Temperature | β | -40 Β°C to +100 Β°C (industrial) |
| Configuration Modes | β | Passive Serial (PS), Active Serial (AS), JTAG |