EP3C40F780C6N vs EP3C40F780C7N Comparison
Detailed side-by-side comparison of EP3C40F780C6N by Intel and EP3C40F780C7N by Intel. Compare key specifications, electrical parameters, packaging, lifecycle status, pricing, and availability to determine the best component for your design requirements.
Specification Comparison
| Parameter | EP3C40F780C6N | EP3C40F780C7N |
|---|---|---|
| Brand | Intel | Intel |
| Category | FPGA & CPLD | FPGA & CPLD |
| Lifecycle Status | Nrnd | Active |
| Stock Status | In Stock | In Stock |
| Unit Price (USD) | $172.00 | $145.40 |
| Family | Cyclone III | Cyclone III |
| Logic Elements | 39,600 | 39,600 LE |
| Embedded Memory Bits | 1,161,216 | β |
| Embedded Memory (Kbytes) | 113 | β |
| M9K Memory Blocks | 126 | β |
| Logic Array Blocks (LABs) | 4,065 | β |
| Maximum User I/O Pins | 535 | β |
| PLLs | 4 | 4 |
| Process Technology | 60 nm CMOS | β |
| Core Voltage | 1.2 V | β |
| Speed Grade | 6 (commercial) | 7 (C7, commercial) |
| Operating Temperature | 0C to +85C (commercial) | 0C to +85C (commercial) |
| Package | 780-ball FBGA (FineLine BGA) | 780-ball FBGA (FineLine BGA) |
| Package Dimensions | 29 x 29 mm | β |
| Ball Pitch | 1.0 mm | β |
| Package Height | 2.6 mm | β |
| Mounting Type | Surface Mount (FBGA) | β |
| Lead Free | Yes | β |
| Configuration Method | SRAM, JTAG via USB-Blaster | JTAG, Active Serial, Passive Serial |
| RoHS Status | Compliant | β |
| Total RAM Bits | β | 1,161,216 bits |
| Embedded Multipliers | β | 126 (18x18) |
| User I/Os | β | 535 |
| Process Node | β | 65 nm TSMC low-power |
| Supply Voltage (Core) | β | 1.2 V |
| Global Clock Networks | β | 20 |
| Lead-Free / RoHS | β | Yes (N suffix) |
| Moisture Sensitivity Level | β | MSL3 (per J-STD-020) |