EP3C40F780C7 vs EP3C40F780C6N Comparison
Detailed side-by-side comparison of EP3C40F780C7 by Intel and EP3C40F780C6N by Intel. Compare key specifications, electrical parameters, packaging, lifecycle status, pricing, and availability to determine the best component for your design requirements.
Specification Comparison
| Parameter | EP3C40F780C7 | EP3C40F780C6N |
|---|---|---|
| Brand | Intel | Intel |
| Category | FPGA & CPLD | FPGA & CPLD |
| Lifecycle Status | Nrnd | Nrnd |
| Stock Status | In Stock | In Stock |
| Unit Price (USD) | $139.50 | $172.00 |
| Family | Cyclone III | Cyclone III |
| Logic Elements (LE) | 39,600 | β |
| Number of Logic Cells | 39,600 | β |
| Total Memory Bits | 1,161,216 bits | β |
| Embedded 18x18 Multipliers | 126 | β |
| Number of PLLs | 4 | β |
| User I/O Count | 535 | β |
| I/O Banks | 8 | β |
| Package | 780-ball FBGA (F780) | 780-ball FBGA (FineLine BGA) |
| Package Dimensions | 29 x 29 mm | 29 x 29 mm |
| Ball Pitch | 1.0 mm | 1.0 mm |
| Core Voltage (VCCINT) | 1.2 V | β |
| I/O Voltage (VCCIO) | 1.2 V to 3.3 V | β |
| Operating Temperature | 0C to +85C (Commercial) | 0C to +85C (commercial) |
| Speed Grade | C7 | 6 (commercial) |
| Process Technology | 60 nm TSMC low-power CMOS | 60 nm CMOS |
| Configuration | Active Serial / Passive Parallel (JTAG) | β |
| MSL Level | 3 (168 hours) | β |
| RoHS Status | Compliant | Compliant |
| Logic Elements | β | 39,600 |
| Embedded Memory Bits | β | 1,161,216 |
| Embedded Memory (Kbytes) | β | 113 |
| M9K Memory Blocks | β | 126 |
| Logic Array Blocks (LABs) | β | 4,065 |
| Maximum User I/O Pins | β | 535 |
| PLLs | β | 4 |
| Core Voltage | β | 1.2 V |
| Package Height | β | 2.6 mm |
| Mounting Type | β | Surface Mount (FBGA) |
| Lead Free | β | Yes |
| Configuration Method | β | SRAM, JTAG via USB-Blaster |