EP3C40F780I7 vs EP3C40F780I8N Comparison

Detailed side-by-side comparison of EP3C40F780I7 by Intel and EP3C40F780I8N by Intel. Compare key specifications, electrical parameters, packaging, lifecycle status, pricing, and availability to determine the best component for your design requirements.

Specification Comparison

Parameter EP3C40F780I7 EP3C40F780I8N
Brand Intel Intel
Category FPGA & CPLD FPGA & CPLD
Lifecycle Status Active Active
Stock Status In Stock In Stock
Unit Price (USD) $52.40 $192.00
Family Cycloneยฎ III Cyclone III
Logic Elements (LEs) 39,600 โ€”
Embedded Memory Bits 1,161,216 bits โ€”
M9K Memory Blocks 234 โ€”
MLAB Memory Bits 112,500 bits โ€”
Embedded Multipliers (18x18) 126 126
9-bit Multiplier Elements 535 โ€”
PLLs 4 โ€”
Maximum User I/Os 535 โ€”
Maximum Operating Frequency 472.5 MHz โ€”
Process Technology 65 nm low-power CMOS TSMC 65 nm low-power CMOS
Core Voltage (VCCINT) 1.2 V โ€”
Package 780-ball FineLine BGA (F780) 780-ball FBGA (F780)
Package Dimensions [DATA_NEEDED: package dimensions in mm] โ€”
Operating Temperature -40C to +100C (industrial, I7) โ€”
RoHS Status Compliant Compliant
Configuration Method JTAG / Active Serial / Passive Serial โ€”
Toolchain Quartus II / Quartus Prime โ€”
Device Logic Elements โ€” 39,600
Logic Array Blocks (LABs/CLBs) โ€” 2,475
Embedded Memory (bits) โ€” 1,161,216
Embedded Memory (Kbits) โ€” 1,134
Number of PLLs โ€” 4
User I/O Pins โ€” 535
I/O Banks โ€” 20
Nominal Core Supply Voltage โ€” 1.2 V (1.15 V to 1.25 V)
Package Ball Pitch โ€” 1.0 mm
Operating Temperature Grade โ€” Industrial (-40 ยฐC to +100 ยฐC junction)
Configuration Modes โ€” Passive Serial, Active Serial (EPCS), JTAG, Fast Passive Parallel
MSL Level โ€” 3
Mounting Type โ€” Surface Mount (BGA)

Datasheets & Resources

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