EP3C40F780I7 vs EP3C40F780I8N Ikinahambing
Detalyadong pagkakahiwalay na pagkakahambing ng EP3C40F780I7 sa pamamagitan ng Intel at EP3C40F780I8N sa pamamagitan ng Intel. Ikinahambing ang mga pangunahing paglalarawan, mga tama ng elektriko, paakay, kalagayan ng buhay, presyo, at pagkakaroon upang makita ang pinakamahusay na komponente para sa iyong mga kinakailangang pang disenyo.
Pagsanggunian na paghahambing
| Parametro | EP3C40F780I7 | EP3C40F780I8N |
|---|---|---|
| Brand | Intel | Intel |
| Kategorya | FPGA & CPLD | FPGA & CPLD |
| Katayuan ng Lifecycle | Aktibo | Aktibo |
| Family | Cyclone® III | Cyclone III |
| Logic Elements (LEs) | 39,600 | — |
| Embedded Memory Bits | 1,161,216 bits | — |
| M9K Memory Blocks | 234 | — |
| MLAB Memory Bits | 112,500 bits | — |
| Embedded Multipliers (18x18) | 126 | 126 |
| 9-bit Multiplier Elements | 535 | — |
| PLLs | 4 | — |
| Maximum User I/Os | 535 | — |
| Maximum Operating Frequency | 472.5 MHz | — |
| Process Technology | 65 nm low-power CMOS | TSMC 65 nm low-power CMOS |
| Core Voltage (VCCINT) | 1.2 V | — |
| Packhaging | 780-ball FineLine BGA (F780) | 780-ball FBGA (F780) |
| Package Dimensions | [DATA_NEEDED: package dimensions in mm] | — |
| Temperature na Operasyon | -40C to +100C (industrial, I7) | — |
| Tindminan RoHS | Compliant | Compliant |
| Configuration Method | JTAG / Active Serial / Passive Serial | — |
| Toolchain | Quartus II / Quartus Prime | — |
| Device Logic Elements | — | 39,600 |
| Logic Array Blocks (LABs/CLBs) | — | 2,475 |
| Embedded Memory (bits) | — | 1,161,216 |
| Embedded Memory (Kbits) | — | 1,134 |
| Number of PLLs | — | 4 |
| User I/O Pins | — | 535 |
| I/O Banks | — | 20 |
| Nominal Core Supply Voltage | — | 1.2 V (1.15 V to 1.25 V) |
| Package Ball Pitch | — | 1.0 mm |
| Operating Temperature Grade | — | Industrial (-40 °C to +100 °C junction) |
| Configuration Modes | — | Passive Serial, Active Serial (EPCS), JTAG, Fast Passive Parallel |
| Level ng MSL | — | 3 |
| Uri ng Pagpapasok | — | Surface Mount (BGA) |