EP3C55F484C6 vs EP3C55F484C7 Comparison
Detailed side-by-side comparison of EP3C55F484C6 by Intel and EP3C55F484C7 by Intel. Compare key specifications, electrical parameters, packaging, lifecycle status, pricing, and availability to determine the best component for your design requirements.
Specification Comparison
| Parameter | EP3C55F484C6 | EP3C55F484C7 |
|---|---|---|
| Brand | Intel | Intel |
| Category | FPGA & CPLD | FPGA & CPLD |
| Lifecycle Status | Active | Last_time_buy |
| Stock Status | In Stock | In Stock |
| Unit Price (USD) | $222.00 | $52.95 |
| Family | Cyclone III | β |
| Series | EP3C55 | β |
| Logic Elements | 55,856 LE | β |
| Embedded Memory | 2,396,160 bits (2.4 Mbit) | β |
| Maximum User I/O | 327 | β |
| Package | 484-FBGA (F484) | FBGA-484 (FineLine BGA, 23 Γ 23 mm, 1.0 mm pitch) |
| Process Technology | 65 nm low-power CMOS | 65 nm TSMC low-k CMOS |
| Core Voltage | 1.2 V | 1.2 V |
| Speed Grade | 6 (commercial) | β |
| Number of PLLs | 4 | β |
| Global Clock Networks | 20 | 20 |
| Embedded 18x18 Multipliers | 56 | 156 |
| I/O Banks | 8 | β |
| Supported I/O Standards | LVDS, LVTTL, LVCMOS, SSTL, HSTL | β |
| Configuration | JTAG, AS (EPCS), PS, FPP | β |
| Mounting Type | Surface Mount (BGA) | Surface Mount (BGA) |
| RoHS Status | Compliant | Compliant (lead-free FBGA) |
| Operating Temperature | 0C to +85C (commercial) | β |
| Device Family | β | Cyclone III |
| Logic Elements (LE) | β | 55,856 |
| Logic Array Blocks (LABs) | β | 3,495 |
| Embedded Memory Bits | β | 2,396,160 bits |
| Embedded Memory (M9K blocks) | β | 260 blocks of 9 Kbit each |
| Maximum User I/Os | β | 327 |
| PLLs | β | 4 |
| Internal Operating Frequency (max) | β | 472 MHz |
| Operating Temperature Grade | β | Commercial (0 Β°C to +85 Β°C) - C7 speed grade |
| Configuration Mode | β | Active Serial (AS), Passive Serial (PS), JTAG |
| Configuration Memory Type | β | SRAM (volatile, requires external flash) |