EP3C55F484C6 vs EP3C55F484C7 Perbandingan
Perbandingan bersamaan detil EP3C55F484C6 dari Intel dan EP3C55F484C7 dari Intel. Bandingkan spesifikasi penting, parameter listrik, pengemasan, status cycle, harga, dan ketersediaan untuk menentukan komponen terbaik untuk kebutuhan desain Anda.
Perbandingan Spesifikasi
| Parameter Umum | EP3C55F484C6 | EP3C55F484C7 |
|---|---|---|
| Merek | Intel | Intel |
| Kategori | FPGA & CPLD | FPGA & CPLD |
| Status Lingkungan Hidup | Aktif | Waktu Pembelian Terakhir |
| Family | Cyclone III | — |
| Series | EP3C55 | — |
| Logic Elements | 55,856 LE | — |
| Embedded Memory | 2,396,160 bits (2.4 Mbit) | — |
| Maximum User I/O | 327 | — |
| Paket | 484-FBGA (F484) | FBGA-484 (FineLine BGA, 23 × 23 mm, 1.0 mm pitch) |
| Process Technology | 65 nm low-power CMOS | 65 nm TSMC low-k CMOS |
| Core Voltage | 1.2 V | 1.2 V |
| Speed Grade | 6 (commercial) | — |
| Number of PLLs | 4 | — |
| Global Clock Networks | 20 | 20 |
| Embedded 18x18 Multipliers | 56 | 156 |
| I/O Banks | 8 | — |
| Supported I/O Standards | LVDS, LVTTL, LVCMOS, SSTL, HSTL | — |
| Configuration | JTAG, AS (EPCS), PS, FPP | — |
| Tipe Mounting | Surface Mount (BGA) | Surface Mount (BGA) |
| Status RoHS | Compliant | Compliant (lead-free FBGA) |
| Suhu Kerja | 0C to +85C (commercial) | — |
| Device Family | — | Cyclone III |
| Logic Elements (LE) | — | 55,856 |
| Logic Array Blocks (LABs) | — | 3,495 |
| Embedded Memory Bits | — | 2,396,160 bits |
| Embedded Memory (M9K blocks) | — | 260 blocks of 9 Kbit each |
| Maximum User I/Os | — | 327 |
| PLLs | — | 4 |
| Internal Operating Frequency (max) | — | 472 MHz |
| Operating Temperature Grade | — | Commercial (0 °C to +85 °C) - C7 speed grade |
| Configuration Mode | — | Active Serial (AS), Passive Serial (PS), JTAG |
| Configuration Memory Type | — | SRAM (volatile, requires external flash) |