EP3C5F256C8N vs EP3C5F256C6N Ikinahambing
Detalyadong pagkakahiwalay na pagkakahambing ng EP3C5F256C8N sa pamamagitan ng Intel at EP3C5F256C6N sa pamamagitan ng Intel. Ikinahambing ang mga pangunahing paglalarawan, mga tama ng elektriko, paakay, kalagayan ng buhay, presyo, at pagkakaroon upang makita ang pinakamahusay na komponente para sa iyong mga kinakailangang pang disenyo.
Pagsanggunian na paghahambing
| Parametro | EP3C5F256C8N | EP3C5F256C6N |
|---|---|---|
| Brand | Intel | Intel |
| Kategorya | FPGA & CPLD | FPGA & CPLD |
| Katayuan ng Lifecycle | Aktibo | Aktibo |
| Series | Cyclone III | EP3C5 |
| Device Family | Cyclone III (EP3C5) | — |
| Logic Elements (LEs) | 5,136 | 5136 |
| Embedded Memory (bits) | 423,936 | — |
| Embedded Memory (Kbits) | 414 Kbits | — |
| Embedded 18x18 Multipliers | 23 | 23 |
| PLLs | 4 | 2 |
| Maximum User I/Os | 182 | 182 |
| Core Voltage | 1.15 V to 1.25 V | 1.2 V |
| Temperature na Operasyon | 0C to 85C (Commercial) | 0 C to +85 C (commercial "C6" speed grade) |
| Packhaging | 256-ball FBGA (FineLine BGA) | 256-ball FBGA (FineLine BGA), 17 x 17 mm, 1 mm pitch |
| Process Technology | 65 nm | — |
| Configuration Memory | SRAM-based (in-system reprogrammable) | — |
| I/O Standards Supported | LVDS, LVTTL, LVCMOS, SSTL, HSTL | — |
| Tindminan RoHS | Lead Free (per Altera/Intel product page) | — |
| Uri ng Pagpapasok | Surface Mount | Surface Mount |
| Family | — | Cyclone III |
| Logic Array Blocks (LABs) | — | 182 (per DigiKey listing) |
| Total Memory Bits | — | 423936 |
| Core Process Technology | — | 65 nm CMOS |
| RoHS / Lead-Free | — | Lead-free (per distributor listings) |
| Configuration Modes | — | Serial, Parallel, JTAG, AS, PS |