EP3C5F256C8N vs EP3C5F256C6N Pengandingan
Pengandingan Sisi Kiri Sisi Kanan Terperinci EP3C5F256C8N disebabkan oleh Intel dan EP3C5F256C6N disebabkan oleh Intel. Bandingkan spesifikasi utama, parameter elektrik, pakej, status kehidupan, harga, dan keupayaan untuk menentukan komponen terbaik untuk keperluan disenjaya anda.
Pengandingan Spesifikasi
| Parametr | EP3C5F256C8N | EP3C5F256C6N |
|---|---|---|
| Merek | Intel | Intel |
| Kategori | FPGA & CPLD | FPGA & CPLD |
| Status Lingkungan Hidup | Aktif | Aktif |
| Series | Cyclone III | EP3C5 |
| Device Family | Cyclone III (EP3C5) | — |
| Logic Elements (LEs) | 5,136 | 5136 |
| Embedded Memory (bits) | 423,936 | — |
| Embedded Memory (Kbits) | 414 Kbits | — |
| Embedded 18x18 Multipliers | 23 | 23 |
| PLLs | 4 | 2 |
| Maximum User I/Os | 182 | 182 |
| Core Voltage | 1.15 V to 1.25 V | 1.2 V |
| Suhu Operasi | 0C to 85C (Commercial) | 0 C to +85 C (commercial "C6" speed grade) |
| Kemasan | 256-ball FBGA (FineLine BGA) | 256-ball FBGA (FineLine BGA), 17 x 17 mm, 1 mm pitch |
| Process Technology | 65 nm | — |
| Configuration Memory | SRAM-based (in-system reprogrammable) | — |
| I/O Standards Supported | LVDS, LVTTL, LVCMOS, SSTL, HSTL | — |
| Status RoHS | Lead Free (per Altera/Intel product page) | — |
| Jenis Pemasangan | Surface Mount | Surface Mount |
| Family | — | Cyclone III |
| Logic Array Blocks (LABs) | — | 182 (per DigiKey listing) |
| Total Memory Bits | — | 423936 |
| Core Process Technology | — | 65 nm CMOS |
| RoHS / Lead-Free | — | Lead-free (per distributor listings) |
| Configuration Modes | — | Serial, Parallel, JTAG, AS, PS |