EP3C5M164C7N vs EP3C5M164I7N Pengandingan
Pengandingan Sisi Kiri Sisi Kanan Terperinci EP3C5M164C7N disebabkan oleh Intel dan EP3C5M164I7N disebabkan oleh Intel. Bandingkan spesifikasi utama, parameter elektrik, pakej, status kehidupan, harga, dan keupayaan untuk menentukan komponen terbaik untuk keperluan disenjaya anda.
Pengandingan Spesifikasi
| Parametr | EP3C5M164C7N | EP3C5M164I7N |
|---|---|---|
| Merek | Intel | Intel |
| Kategori | FPGA & CPLD | FPGA & CPLD |
| Status Lingkungan Hidup | Aktif | Aktif |
| Family | Cyclone III | — |
| Device Logic Elements | 5,136 | — |
| Total Memory Bits | 423,936 bits | — |
| Embedded Memory | M9K blocks (RAM) | 423936 bits (approx. 414 Kbit) |
| Embedded Multipliers (18x18) | 23 | — |
| User I/O Pins | 106 (max) | 106 |
| Kemasan | 164-ball MBGA (8x8 mm, 0.5 mm pitch) | 164-TFBGA (Micro BGA, M164, 8x8 mm) |
| Process Technology | 65 nm TSMC low-power | 60 nm TSMC low-k |
| PLLs | 4 | 2 |
| Suhu Operasi | 0C to +85C (commercial) | — |
| Speed Grade | 7 | 7 |
| Configuration Mode | JTAG / Active Serial (AS) / Passive Serial (PS) | — |
| Jenis Pemasangan | Surface Mount | Surface Mount |
| Aras MSL | 3 | [DATA_NEEDED: MSL level] |
| Status RoHS | Compliant | Compliant |
| Logic Elements (LE) | — | 5136 |
| Embedded Multipliers | — | 23 x 18x18 |
| Core Voltage (VCCINT) | — | 1.2 V |
| Temperature Grade | — | Industrial (-40C to +100C junction) |
| Ball Pitch | — | 0.5 mm |
| Configuration Modes | — | PS, FPP, AS |
| External Memory Support | — | DDR, DDR2, SDR, QDRII+ SRAM |
| I/O Standards | — | LVDS, SSTL, HSTL, LVCMOS |
| Suhu Hubungan Operasi | — | -40C to +100C |