EP3C5M164C7N vs EP3C5M164I7N Perbandingan
Perbandingan bersamaan detil EP3C5M164C7N dari Intel dan EP3C5M164I7N dari Intel. Bandingkan spesifikasi penting, parameter listrik, pengemasan, status cycle, harga, dan ketersediaan untuk menentukan komponen terbaik untuk kebutuhan desain Anda.
Perbandingan Spesifikasi
| Parameter Umum | EP3C5M164C7N | EP3C5M164I7N |
|---|---|---|
| Merek | Intel | Intel |
| Kategori | FPGA & CPLD | FPGA & CPLD |
| Status Lingkungan Hidup | Aktif | Aktif |
| Family | Cyclone III | — |
| Device Logic Elements | 5,136 | — |
| Total Memory Bits | 423,936 bits | — |
| Embedded Memory | M9K blocks (RAM) | 423936 bits (approx. 414 Kbit) |
| Embedded Multipliers (18x18) | 23 | — |
| User I/O Pins | 106 (max) | 106 |
| Paket | 164-ball MBGA (8x8 mm, 0.5 mm pitch) | 164-TFBGA (Micro BGA, M164, 8x8 mm) |
| Process Technology | 65 nm TSMC low-power | 60 nm TSMC low-k |
| PLLs | 4 | 2 |
| Suhu Kerja | 0C to +85C (commercial) | — |
| Speed Grade | 7 | 7 |
| Configuration Mode | JTAG / Active Serial (AS) / Passive Serial (PS) | — |
| Tipe Mounting | Surface Mount | Surface Mount |
| Level MSL | 3 | [DATA_NEEDED: MSL level] |
| Status RoHS | Compliant | Compliant |
| Logic Elements (LE) | — | 5136 |
| Embedded Multipliers | — | 23 x 18x18 |
| Core Voltage (VCCINT) | — | 1.2 V |
| Temperature Grade | — | Industrial (-40C to +100C junction) |
| Ball Pitch | — | 0.5 mm |
| Configuration Modes | — | PS, FPP, AS |
| External Memory Support | — | DDR, DDR2, SDR, QDRII+ SRAM |
| I/O Standards | — | LVDS, SSTL, HSTL, LVCMOS |
| Suhu Hubung Kerja | — | -40C to +100C |