EP3C5U256C8N vs EP3C16U256C8N Comparison
Detailed side-by-side comparison of EP3C5U256C8N by Intel and EP3C16U256C8N by Intel. Compare key specifications, electrical parameters, packaging, lifecycle status, pricing, and availability to determine the best component for your design requirements.
Specification Comparison
| Parameter | EP3C5U256C8N | EP3C16U256C8N |
|---|---|---|
| Brand | Intel | Intel |
| Category | FPGA & CPLD | FPGA & CPLD |
| Lifecycle Status | Active | Active |
| Stock Status | In Stock | In Stock |
| Unit Price (USD) | $19.85 | $48.40 |
| Series | Cyclone III | โ |
| Family Name | Cycloneยฎ III | โ |
| Logic Elements (LE) | 5,136 | โ |
| Number of CLBs | 5,136 | โ |
| Number of Logic Cells | 5,136 | โ |
| Total RAM Bits | 423,936 | โ |
| Number of I/O | 182 | โ |
| Supply Voltage | 1.2 V core, 1.2-3.3 V I/O | โ |
| Number of Embedded Multipliers (18x18) | 46 | โ |
| Number of PLLs | 4 | โ |
| Maximum Operating Frequency | [DATA_NEEDED: maximum operating frequency] | โ |
| Speed Grade | 8 (commercial) | 8 (C8, commercial) |
| Package | 256-UBGA (Ultra FineLine BGA) | 256-ball Ultra FineLine BGA (Ux256, 17 mm x 17 mm) |
| Package Dimensions | 14 x 14 mm, 0.8 mm ball pitch | โ |
| Mounting Type | Surface Mount | Surface Mount (BGA, requires microvia PCB) |
| Lead Free / RoHS | Lead Free, RoHS Compliant | โ |
| Operating Temperature | 0C to +85C (commercial, "C" suffix) | โ |
| Process Technology | 60 nm CMOS, SRAM-based configuration | 65 nm low-power |
| Family | โ | Cyclone III |
| Logic Elements | โ | 15,408 |
| Total Memory Bits | โ | 516,096 bits |
| Embedded Multipliers (18 x 18) | โ | 56 |
| PLLs | โ | 4 |
| Maximum User I/O | โ | 168 |
| Core Voltage (VCCINT) | โ | 1.2 V |
| Operating Junction Temperature | โ | -40 ยฐC to +85 ยฐC |
| Configuration Modes | โ | JTAG, AS, PS, FPP |
| MSL Level | โ | [DATA_NEEDED: MSL level] |
| RoHS Status | โ | Compliant (Pb-free) |