EP3C5U256C8N vs EP3C16U256C8N Comparación
Comparación detallada lado a lado de EP3C5U256C8N por Intel y EP3C16U256C8N por Intel. Compare las especificaciones clave, los parámetros eléctricos, el encapsulado, el estado del ciclo de vida, los precios y la disponibilidad para determinar el mejor componente para los requisitos de su diseño.
Comparación de especificaciones
| Parámetro | EP3C5U256C8N | EP3C16U256C8N |
|---|---|---|
| Marca | Intel | Intel |
| Categoría | FPGA & CPLD | FPGA & CPLD |
| Estado del ciclo de vida | Activo | Activo |
| Estado del stock | In Stock | In Stock |
| Precio unitario (USD) | $19,85 | $48,40 |
| Series | Cyclone III | — |
| Family Name | Cyclone® III | — |
| Logic Elements (LE) | 5,136 | — |
| Number of CLBs | 5,136 | — |
| Number of Logic Cells | 5,136 | — |
| Total RAM Bits | 423,936 | — |
| Number of I/O | 182 | — |
| Tensión de alimentación | 1.2 V core, 1.2-3.3 V I/O | — |
| Number of Embedded Multipliers (18x18) | 46 | — |
| Number of PLLs | 4 | — |
| Maximum Operating Frequency | [DATA_NEEDED: maximum operating frequency] | — |
| Speed Grade | 8 (commercial) | 8 (C8, commercial) |
| Encapsulado | 256-UBGA (Ultra FineLine BGA) | 256-ball Ultra FineLine BGA (Ux256, 17 mm x 17 mm) |
| Package Dimensions | 14 x 14 mm, 0.8 mm ball pitch | — |
| Tipo de montaje | Surface Mount | Surface Mount (BGA, requires microvia PCB) |
| Lead Free / RoHS | Lead Free, RoHS Compliant | — |
| Temperatura de funcionamiento | 0C to +85C (commercial, "C" suffix) | — |
| Process Technology | 60 nm CMOS, SRAM-based configuration | 65 nm low-power |
| Family | — | Cyclone III |
| Logic Elements | — | 15,408 |
| Total Memory Bits | — | 516,096 bits |
| Embedded Multipliers (18 x 18) | — | 56 |
| PLLs | — | 4 |
| Maximum User I/O | — | 168 |
| Core Voltage (VCCINT) | — | 1.2 V |
| Temperatura de unión de funcionamiento | — | -40 °C to +85 °C |
| Configuration Modes | — | JTAG, AS, PS, FPP |
| Nivel MSL | — | [DATA_NEEDED: MSL level] |
| Estado RoHS | — | Compliant (Pb-free) |