EP3C5U256C8N vs EP3C16U256C8N Vergleich
Detaillierter Direktvergleich von EP3C5U256C8N von Intel und EP3C16U256C8N von Intel. Vergleichen Sie die wichtigsten Spezifikationen, elektrischen Parameter, Gehäuse, Lebenszyklusstatus, Preise und Verfügbarkeit, um das beste Bauteil für Ihre Designanforderungen zu ermitteln.
Spezifikationsvergleich
| Parameter | EP3C5U256C8N | EP3C16U256C8N |
|---|---|---|
| Marke | Intel | Intel |
| Kategorie | FPGA & CPLD | FPGA & CPLD |
| Lebenszyklusstatus | Aktiv | Aktiv |
| Lagerstatus | In Stock | In Stock |
| Stückpreis (USD) | $19,85 | $48,40 |
| Series | Cyclone III | — |
| Family Name | Cyclone® III | — |
| Logic Elements (LE) | 5,136 | — |
| Number of CLBs | 5,136 | — |
| Number of Logic Cells | 5,136 | — |
| Total RAM Bits | 423,936 | — |
| Number of I/O | 182 | — |
| Versorgungsspannung | 1.2 V core, 1.2-3.3 V I/O | — |
| Number of Embedded Multipliers (18x18) | 46 | — |
| Number of PLLs | 4 | — |
| Maximum Operating Frequency | [DATA_NEEDED: maximum operating frequency] | — |
| Speed Grade | 8 (commercial) | 8 (C8, commercial) |
| Gehäuse | 256-UBGA (Ultra FineLine BGA) | 256-ball Ultra FineLine BGA (Ux256, 17 mm x 17 mm) |
| Package Dimensions | 14 x 14 mm, 0.8 mm ball pitch | — |
| Montageart | Surface Mount | Surface Mount (BGA, requires microvia PCB) |
| Lead Free / RoHS | Lead Free, RoHS Compliant | — |
| Betriebstemperatur | 0C to +85C (commercial, "C" suffix) | — |
| Process Technology | 60 nm CMOS, SRAM-based configuration | 65 nm low-power |
| Family | — | Cyclone III |
| Logic Elements | — | 15,408 |
| Total Memory Bits | — | 516,096 bits |
| Embedded Multipliers (18 x 18) | — | 56 |
| PLLs | — | 4 |
| Maximum User I/O | — | 168 |
| Core Voltage (VCCINT) | — | 1.2 V |
| Betriebs-Sperrschichttemperatur | — | -40 °C to +85 °C |
| Configuration Modes | — | JTAG, AS, PS, FPP |
| MSL-Level | — | [DATA_NEEDED: MSL level] |
| RoHS-Status | — | Compliant (Pb-free) |