EP3CLS100F484C8N vs EP3CLS200F484C8N Perbandingan
Perbandingan bersamaan detil EP3CLS100F484C8N dari Intel dan EP3CLS200F484C8N dari Intel. Bandingkan spesifikasi penting, parameter listrik, pengemasan, status cycle, harga, dan ketersediaan untuk menentukan komponen terbaik untuk kebutuhan desain Anda.
Perbandingan Spesifikasi
| Parameter Umum | EP3CLS100F484C8N | EP3CLS200F484C8N |
|---|---|---|
| Merek | Intel | Intel |
| Kategori | FPGA & CPLD | FPGA & CPLD |
| Status Lingkungan Hidup | Aktif | Aktif |
| Series | Cyclone® III LS | Cyclone III LS |
| Family Name | Cyclone III LS | — |
| Logic Elements | 100,448 | 198,464 |
| Embedded Memory Bits | 4,451,328 bits | — |
| Number of I/O | 278 (maximum user I/O) | — |
| Number of Logic Blocks / Cells | 47 (logic blocks reported by DigChip snapshot) | — |
| Package Type | FBGA-484 (FineLine BGA, lead-free) | — |
| Pin / Ball Count | 484 | — |
| Supply Voltage (Core) | 1.2 V | — |
| Speed Grade | C8 (commercial, fastest) | 8 (slowest) |
| Process Technology | TSMC 65 nm low-power (LP) | 65 nm CMOS, low-leakage |
| Suhu Kerja | 0°C to +85°C (commercial grade) | — |
| Tipe Mounting | Surface Mount | Surface Mount (BGA) |
| Configuration Interface | JTAG, Passive Serial, Active Serial | — |
| Bitstream Encryption | AES-128 (Cyclone III LS security feature) | AES-128 (256-bit key via separate license) |
| Status RoHS | Compliant (Pb-free, 'N' suffix) | Compliant |
| Level MSL | 3 (per JEDEC J-STD-020, typical for BGA) | — |
| Embedded Multipliers (18x18) | 4,488 (per Cyclone III LS family handbook, 100K LE tier) | 396 |
| PLLs | 4 (per Cyclone III LS family) | — |
| DSP Blocks | Integrated (multiplier-based) | — |
| Family | — | Cyclone® III LS |
| Embedded Memory | — | 8,211,456 bits (8.21 Mbit) |
| Logic Array Blocks (LABs) | — | [DATA_NEEDED: exact LAB count] |
| User I/O Pins | — | 210 |
| Number of PLLs | — | 4 |
| Global Clock Networks | — | 20 |
| Core Voltage | — | 1.2 V |
| Maximum Operating Frequency | — | 402 MHz (fabric) |
| Paket | — | 484-ball FBGA (FineLine BGA), 23 x 23 mm |
| Temperature Grade | — | Commercial (0C to +85C TJ) |
| Configuration Mode | — | Active Serial (AS), Active Parallel (AP), Passive Serial (PS), JTAG |