EP3CLS100F484C8N vs EP3CLS200F484C8N Pengandingan
Pengandingan Sisi Kiri Sisi Kanan Terperinci EP3CLS100F484C8N disebabkan oleh Intel dan EP3CLS200F484C8N disebabkan oleh Intel. Bandingkan spesifikasi utama, parameter elektrik, pakej, status kehidupan, harga, dan keupayaan untuk menentukan komponen terbaik untuk keperluan disenjaya anda.
Pengandingan Spesifikasi
| Parametr | EP3CLS100F484C8N | EP3CLS200F484C8N |
|---|---|---|
| Merek | Intel | Intel |
| Kategori | FPGA & CPLD | FPGA & CPLD |
| Status Lingkungan Hidup | Aktif | Aktif |
| Series | Cyclone® III LS | Cyclone III LS |
| Family Name | Cyclone III LS | — |
| Logic Elements | 100,448 | 198,464 |
| Embedded Memory Bits | 4,451,328 bits | — |
| Number of I/O | 278 (maximum user I/O) | — |
| Number of Logic Blocks / Cells | 47 (logic blocks reported by DigChip snapshot) | — |
| Package Type | FBGA-484 (FineLine BGA, lead-free) | — |
| Pin / Ball Count | 484 | — |
| Supply Voltage (Core) | 1.2 V | — |
| Speed Grade | C8 (commercial, fastest) | 8 (slowest) |
| Process Technology | TSMC 65 nm low-power (LP) | 65 nm CMOS, low-leakage |
| Suhu Operasi | 0°C to +85°C (commercial grade) | — |
| Jenis Pemasangan | Surface Mount | Surface Mount (BGA) |
| Configuration Interface | JTAG, Passive Serial, Active Serial | — |
| Bitstream Encryption | AES-128 (Cyclone III LS security feature) | AES-128 (256-bit key via separate license) |
| Status RoHS | Compliant (Pb-free, 'N' suffix) | Compliant |
| Aras MSL | 3 (per JEDEC J-STD-020, typical for BGA) | — |
| Embedded Multipliers (18x18) | 4,488 (per Cyclone III LS family handbook, 100K LE tier) | 396 |
| PLLs | 4 (per Cyclone III LS family) | — |
| DSP Blocks | Integrated (multiplier-based) | — |
| Family | — | Cyclone® III LS |
| Embedded Memory | — | 8,211,456 bits (8.21 Mbit) |
| Logic Array Blocks (LABs) | — | [DATA_NEEDED: exact LAB count] |
| User I/O Pins | — | 210 |
| Number of PLLs | — | 4 |
| Global Clock Networks | — | 20 |
| Core Voltage | — | 1.2 V |
| Maximum Operating Frequency | — | 402 MHz (fabric) |
| Kemasan | — | 484-ball FBGA (FineLine BGA), 23 x 23 mm |
| Temperature Grade | — | Commercial (0C to +85C TJ) |
| Configuration Mode | — | Active Serial (AS), Active Parallel (AP), Passive Serial (PS), JTAG |