EP3CLS200F484C7N vs EP3CLS100F484C7N Comparison

Detailed side-by-side comparison of EP3CLS200F484C7N by Intel and EP3CLS100F484C7N by Intel. Compare key specifications, electrical parameters, packaging, lifecycle status, pricing, and availability to determine the best component for your design requirements.

Specification Comparison

Parameter EP3CLS200F484C7N EP3CLS100F484C7N
Brand Intel Intel
Category FPGA & CPLD FPGA & CPLD
Lifecycle Status Active Active
Stock Status In Stock In Stock
Unit Price (USD) $1,650.00 $495.80
Series Cyclone III LS β€”
Logic Elements (LE) 198,464 β€”
Logic Array Blocks (LAB) 12,404 β€”
Embedded Memory 8,211,456 bits β€”
Embedded 18x18 Multipliers 210 β€”
User I/O 226 β€”
Package 484-ball FBGA (FineLine BGA, 23x23 mm) 484-ball FineLine BGA (FBGA-484)
Core Voltage 1.2 V β€”
Operating Temperature 0C to +85C (commercial) β€”
Process Technology 65 nm low-power CMOS 65 nm low-power (TSMC)
Configuration Modes AS, PS, JTAG (IEEE 1149.1) β€”
I/O Standards LVDS, LVTTL, LVCMOS, SSTL, HSTL β€”
Number of I/O Banks 8 β€”
Hot Socketing Supported β€”
PLLs 4 4
RoHS Status Compliant Compliant (lead-free, N suffix)
Mounting Type Surface Mount Surface Mount
Family β€” Cyclone III LS
Logic Elements β€” 100,448
Embedded Memory (bits) β€” 4,451,328
User I/O Pins β€” 278
DSP Blocks (18x18 multipliers) β€” [DATA_NEEDED: DSP block count]
Global Clock Networks β€” [DATA_NEEDED: global clock count]
Core Supply Voltage β€” 1.2 V
Operating Temperature (junction) β€” 0Β°C to +85Β°C (commercial)
Speed Grade β€” C7
Ball Pitch β€” 1.0 mm
Package Dimensions β€” [DATA_NEEDED: package body dimensions]
Configuration Method β€” SRAM-based (volatile), via EPCS/JTAG/parallel flash
Security Features β€” Bitstream encryption, JTAG tamper protection
Design Software β€” Quartus II / Intel Quartus Prime

Datasheets & Resources

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