EP3SE110F780C4L vs EP3SE50F780C4L Comparison
Detailed side-by-side comparison of EP3SE110F780C4L by Intel and EP3SE50F780C4L by Intel. Compare key specifications, electrical parameters, packaging, lifecycle status, pricing, and availability to determine the best component for your design requirements.
Specification Comparison
| Parameter | EP3SE110F780C4L | EP3SE50F780C4L |
|---|---|---|
| Brand | Intel | Intel |
| Category | FPGA & CPLD | FPGA & CPLD |
| Lifecycle Status | Active | Nrnd |
| Stock Status | In Stock | In Stock |
| Unit Price (USD) | $1,550.00 | $1,320.00 |
| Series | Stratix III E | Stratix III E |
| Number of Logic Elements (LE) | 107,500 | β |
| Number of Logic Array Blocks (LAB) | [DATA_NEEDED: number of LABs] | β |
| Total Memory Bits | 8,936,448 bits | β |
| Number of 18x18 Multipliers | 488 | β |
| Number of PLLs | [DATA_NEEDED: PLL count] | β |
| User I/O Pins | 488 | β |
| Speed Grade | -4 (commercial) | C4 (commercial, speed 4) |
| Process Variant | L (low-leakage) | β |
| Operating Temperature | 0C to +85C (commercial) | [DATA_NEEDED: full industrial/commercial grade] |
| Supply Voltage (Core) | [DATA_NEEDED: core voltage] | β |
| Package Type | 780-Ball FCBGA | β |
| Ball Pitch | 1.0 mm | β |
| Mounting Type | Surface Mount | β |
| Process Technology | 65 nm CMOS | β |
| RoHS Status | Compliant | Compliant (lead-free) |
| MSL Level | 3 (per JEDEC J-STD-020) | β |
| Family | β | Stratix III |
| Logic Elements (LE) | β | 47,500 |
| Embedded Memory | β | 5,760,000 bits |
| User I/Os | β | 488 |
| DSP Blocks (18x18 multipliers) | β | 304 (19x16) |
| Package | β | 780-ball FCBGA (Flip-Chip BGA) |
| Process Node | β | 40 nm |
| Core Voltage | β | 1.1 V |
| Lead-Free (L suffix) | β | Yes |
| Configuration Method | β | Passive Serial / Fast Passive Parallel / JTAG / Enhanced |
| Transceivers | β | [DATA_NEEDED: per Stratix III E variant] |
| PLLs | β | [DATA_NEEDED: PLL count] |