EP3SE110F780C4L vs EP3SE50F780C4L 对比
详细并排对比 EP3SE110F780C4L 出自 Intel 和 EP3SE50F780C4L 出自 Intel。对比关键规格、电气参数、封装、生命周期状态、价格和供货情况，以确定最适合您设计需求的元器件。
规格对比
| 参数 | EP3SE110F780C4L | EP3SE50F780C4L |
|---|---|---|
| 品牌 | Intel | Intel |
| 分类 | FPGA & CPLD | FPGA & CPLD |
| 生命周期状态 | 有效 | 不推荐新设计 |
| 库存状态 | 有库存 | 有库存 |
| 单价（USD） | $1,550.00 | $1,320.00 |
| Series | Stratix III E | Stratix III E |
| Number of Logic Elements (LE) | 107,500 | — |
| Number of Logic Array Blocks (LAB) | [DATA_NEEDED: number of LABs] | — |
| Total Memory Bits | 8,936,448 bits | — |
| Number of 18x18 Multipliers | 488 | — |
| Number of PLLs | [DATA_NEEDED: PLL count] | — |
| User I/O Pins | 488 | — |
| Speed Grade | -4 (commercial) | C4 (commercial, speed 4) |
| Process Variant | L (low-leakage) | — |
| 工作温度 | 0C to +85C (commercial) | [DATA_NEEDED: full industrial/commercial grade] |
| Supply Voltage (Core) | [DATA_NEEDED: core voltage] | — |
| Package Type | 780-Ball FCBGA | — |
| Ball Pitch | 1.0 mm | — |
| 安装类型 | Surface Mount | — |
| Process Technology | 65 nm CMOS | — |
| RoHS 状态 | Compliant | Compliant (lead-free) |
| MSL 等级 | 3 (per JEDEC J-STD-020) | — |
| Family | — | Stratix III |
| Logic Elements (LE) | — | 47,500 |
| Embedded Memory | — | 5,760,000 bits |
| User I/Os | — | 488 |
| DSP Blocks (18x18 multipliers) | — | 304 (19x16) |
| 封装 | — | 780-ball FCBGA (Flip-Chip BGA) |
| Process Node | — | 40 nm |
| Core Voltage | — | 1.1 V |
| Lead-Free (L suffix) | — | Yes |
| Configuration Method | — | Passive Serial / Fast Passive Parallel / JTAG / Enhanced |
| Transceivers | — | [DATA_NEEDED: per Stratix III E variant] |
| PLLs | — | [DATA_NEEDED: PLL count] |