EP3SE110F780C4L vs EP3SE50F780C4L Vergleich
Detaillierter Direktvergleich von EP3SE110F780C4L von Intel und EP3SE50F780C4L von Intel. Vergleichen Sie die wichtigsten Spezifikationen, elektrischen Parameter, Gehäuse, Lebenszyklusstatus, Preise und Verfügbarkeit, um das beste Bauteil für Ihre Designanforderungen zu ermitteln.
Spezifikationsvergleich
| Parameter | EP3SE110F780C4L | EP3SE50F780C4L |
|---|---|---|
| Marke | Intel | Intel |
| Kategorie | FPGA & CPLD | FPGA & CPLD |
| Lebenszyklusstatus | Aktiv | NRND |
| Lagerstatus | In Stock | In Stock |
| Stückpreis (USD) | $1.550,00 | $1.320,00 |
| Series | Stratix III E | Stratix III E |
| Number of Logic Elements (LE) | 107,500 | — |
| Number of Logic Array Blocks (LAB) | [DATA_NEEDED: number of LABs] | — |
| Total Memory Bits | 8,936,448 bits | — |
| Number of 18x18 Multipliers | 488 | — |
| Number of PLLs | [DATA_NEEDED: PLL count] | — |
| User I/O Pins | 488 | — |
| Speed Grade | -4 (commercial) | C4 (commercial, speed 4) |
| Process Variant | L (low-leakage) | — |
| Betriebstemperatur | 0C to +85C (commercial) | [DATA_NEEDED: full industrial/commercial grade] |
| Supply Voltage (Core) | [DATA_NEEDED: core voltage] | — |
| Package Type | 780-Ball FCBGA | — |
| Ball Pitch | 1.0 mm | — |
| Montageart | Surface Mount | — |
| Process Technology | 65 nm CMOS | — |
| RoHS-Status | Compliant | Compliant (lead-free) |
| MSL-Level | 3 (per JEDEC J-STD-020) | — |
| Family | — | Stratix III |
| Logic Elements (LE) | — | 47,500 |
| Embedded Memory | — | 5,760,000 bits |
| User I/Os | — | 488 |
| DSP Blocks (18x18 multipliers) | — | 304 (19x16) |
| Gehäuse | — | 780-ball FCBGA (Flip-Chip BGA) |
| Process Node | — | 40 nm |
| Core Voltage | — | 1.1 V |
| Lead-Free (L suffix) | — | Yes |
| Configuration Method | — | Passive Serial / Fast Passive Parallel / JTAG / Enhanced |
| Transceivers | — | [DATA_NEEDED: per Stratix III E variant] |
| PLLs | — | [DATA_NEEDED: PLL count] |