EP3SE260F1152I4LN vs EP3SE260F1152I3 Comparison
Detailed side-by-side comparison of EP3SE260F1152I4LN by Intel and EP3SE260F1152I3 by Intel. Compare key specifications, electrical parameters, packaging, lifecycle status, pricing, and availability to determine the best component for your design requirements.
Specification Comparison
| Parameter | EP3SE260F1152I4LN | EP3SE260F1152I3 |
|---|---|---|
| Brand | Intel | Intel |
| Category | FPGA & CPLD | FPGA & CPLD |
| Lifecycle Status | Active | Obsolete |
| Family | Stratix III E | — |
| Process Node | 65 nm CMOS | — |
| Logic Elements (LE) | 255,000 | — |
| Logic Array Blocks (LAB) | 10,200 | — |
| Embedded Memory Bits | 16,672,640 | — |
| User I/Os | 744 | — |
| Package | FCBGA-1152 (1517-ball) | 1152-BBGA, FC-FBGA (Flip-Chip) |
| Package Dimensions | 35 x 35 mm | — |
| Core Voltage | 0.9 V (supports 1.05-1.15 V variant) | 1.1 V |
| Operating Temperature | -40 C to +100 C (Industrial) | -40C to +100C (Industrial) |
| Operating Frequency | Up to 717 MHz | — |
| Mounting Type | Surface Mount | Surface Mount |
| Supply Voltage Range | 0.9 V core, 1.05 V-1.15 V supported | — |
| Series | Stratix III | Stratix III E (EP3SE260) |
| RoHS Status | Compliant | [DATA_NEEDED: RoHS status] |
| Design Tool | Quartus II | — |
| Logic Elements | — | 255,000 |
| Number of LABs/CLBs | — | 10,200 |
| Total RAM Bits | — | 16,672,768 |
| User I/O Count | — | 744 |
| Number of Embedded Multipliers (DSP blocks) | — | 768 |
| Process Technology | — | 65 nm |
| Maximum Fabric Frequency | — | 500 MHz |
| Speed Grade | — | I3 (Industrial, speed bin 3) |
| MSL Level | — | [DATA_NEEDED: MSL level] |
| Product Status | — | Obsolete (per Xecor comparator) |