EP3SE260F1152I4LN vs EP3SE260F1152I3 Pengandingan
Pengandingan Sisi Kiri Sisi Kanan Terperinci EP3SE260F1152I4LN disebabkan oleh Intel dan EP3SE260F1152I3 disebabkan oleh Intel. Bandingkan spesifikasi utama, parameter elektrik, pakej, status kehidupan, harga, dan keupayaan untuk menentukan komponen terbaik untuk keperluan disenjaya anda.
Pengandingan Spesifikasi
| Parametr | EP3SE260F1152I4LN | EP3SE260F1152I3 |
|---|---|---|
| Merek | Intel | Intel |
| Kategori | FPGA & CPLD | FPGA & CPLD |
| Status Lingkungan Hidup | Aktif | Obsolete |
| Family | Stratix III E | — |
| Process Node | 65 nm CMOS | — |
| Logic Elements (LE) | 255,000 | — |
| Logic Array Blocks (LAB) | 10,200 | — |
| Embedded Memory Bits | 16,672,640 | — |
| User I/Os | 744 | — |
| Kemasan | FCBGA-1152 (1517-ball) | 1152-BBGA, FC-FBGA (Flip-Chip) |
| Package Dimensions | 35 x 35 mm | — |
| Core Voltage | 0.9 V (supports 1.05-1.15 V variant) | 1.1 V |
| Suhu Operasi | -40 C to +100 C (Industrial) | -40C to +100C (Industrial) |
| Operating Frequency | Up to 717 MHz | — |
| Jenis Pemasangan | Surface Mount | Surface Mount |
| Supply Voltage Range | 0.9 V core, 1.05 V-1.15 V supported | — |
| Series | Stratix III | Stratix III E (EP3SE260) |
| Status RoHS | Compliant | [DATA_NEEDED: RoHS status] |
| Design Tool | Quartus II | — |
| Logic Elements | — | 255,000 |
| Number of LABs/CLBs | — | 10,200 |
| Total RAM Bits | — | 16,672,768 |
| User I/O Count | — | 744 |
| Number of Embedded Multipliers (DSP blocks) | — | 768 |
| Process Technology | — | 65 nm |
| Maximum Fabric Frequency | — | 500 MHz |
| Speed Grade | — | I3 (Industrial, speed bin 3) |
| Aras MSL | — | [DATA_NEEDED: MSL level] |
| Product Status | — | Obsolete (per Xecor comparator) |