EP3SE260F1152I4LN vs EP3SE260F1152I3 Perbandingan
Perbandingan bersamaan detil EP3SE260F1152I4LN dari Intel dan EP3SE260F1152I3 dari Intel. Bandingkan spesifikasi penting, parameter listrik, pengemasan, status cycle, harga, dan ketersediaan untuk menentukan komponen terbaik untuk kebutuhan desain Anda.
Perbandingan Spesifikasi
| Parameter Umum | EP3SE260F1152I4LN | EP3SE260F1152I3 |
|---|---|---|
| Merek | Intel | Intel |
| Kategori | FPGA & CPLD | FPGA & CPLD |
| Status Lingkungan Hidup | Aktif | Obsolete |
| Family | Stratix III E | — |
| Process Node | 65 nm CMOS | — |
| Logic Elements (LE) | 255,000 | — |
| Logic Array Blocks (LAB) | 10,200 | — |
| Embedded Memory Bits | 16,672,640 | — |
| User I/Os | 744 | — |
| Paket | FCBGA-1152 (1517-ball) | 1152-BBGA, FC-FBGA (Flip-Chip) |
| Package Dimensions | 35 x 35 mm | — |
| Core Voltage | 0.9 V (supports 1.05-1.15 V variant) | 1.1 V |
| Suhu Kerja | -40 C to +100 C (Industrial) | -40C to +100C (Industrial) |
| Operating Frequency | Up to 717 MHz | — |
| Tipe Mounting | Surface Mount | Surface Mount |
| Supply Voltage Range | 0.9 V core, 1.05 V-1.15 V supported | — |
| Series | Stratix III | Stratix III E (EP3SE260) |
| Status RoHS | Compliant | [DATA_NEEDED: RoHS status] |
| Design Tool | Quartus II | — |
| Logic Elements | — | 255,000 |
| Number of LABs/CLBs | — | 10,200 |
| Total RAM Bits | — | 16,672,768 |
| User I/O Count | — | 744 |
| Number of Embedded Multipliers (DSP blocks) | — | 768 |
| Process Technology | — | 65 nm |
| Maximum Fabric Frequency | — | 500 MHz |
| Speed Grade | — | I3 (Industrial, speed bin 3) |
| Level MSL | — | [DATA_NEEDED: MSL level] |
| Product Status | — | Obsolete (per Xecor comparator) |