EP3SE260H780C3 vs EP3SE260F1152C3 Comparison
Detailed side-by-side comparison of EP3SE260H780C3 by Intel and EP3SE260F1152C3 by Intel. Compare key specifications, electrical parameters, packaging, lifecycle status, pricing, and availability to determine the best component for your design requirements.
Intel
EP3SE260F1152C3 - 255K LEs Stratix III E FPGA | Intel / Altera
EP3SE260F1152C3 β Last Time BuySpecification Comparison
| Parameter | EP3SE260H780C3 | EP3SE260F1152C3 |
|---|---|---|
| Brand | Intel | Intel |
| Category | FPGA & CPLD | FPGA & CPLD |
| Lifecycle Status | Active | Last_time_buy |
| Stock Status | In Stock | In Stock |
| Unit Price (USD) | $1,180.00 | $12,500.00 |
| Device Family | Stratix III Enhanced (Stratix III E) | β |
| Series | EP3SE | Stratix III E |
| Logic Elements | 255,000 | 255,000 |
| Logic Array Blocks (LABs) | 10200 | 10,200 |
| Embedded Memory | 16,672,768 bits (16.67 Mbit) | β |
| User I/Os | 488 | 744 |
| Operating Voltage (Core) | 0.9 V | β |
| Operating Voltage (Auxiliary) | 1.1 V | β |
| Process Technology | 65 nm CMOS | 40 nm |
| Speed Grade | C3 | C3 |
| Operating Temperature | Commercial, 0C to +85C | 0C to +85C (Commercial) |
| Maximum Core Frequency | 500 MHz | β |
| Package | 780-ball FCBGA (HBGA), flip-chip | 1152-ball FCBGA (Flip-Chip BGA) |
| Mounting Type | Surface Mount (BGA) | Surface Mount |
| Moisture Sensitivity Level (MSL) | 3 (168 hours) | β |
| Packaging Type | Tray | β |
| Configuration Memory Support | Fast passive parallel, JTAG, Active Serial | β |
| RoHS Status | Compliant (per product listings) | Compliant |
| Embedded Memory (bits) | β | 16,672,768 |
| Embedded 18x18 Multipliers | β | 384 |
| Core Voltage | β | 0.9 V to 1.1 V |
| Configuration Method | β | Passive Serial / Fast Passive Parallel / JTAG |
| PLLs | β | 12 |