EP3SE260H780C3 vs EP3SE260F1152C3 Vergleich
Detaillierter Direktvergleich von EP3SE260H780C3 von Intel und EP3SE260F1152C3 von Intel. Vergleichen Sie die wichtigsten Spezifikationen, elektrischen Parameter, Gehäuse, Lebenszyklusstatus, Preise und Verfügbarkeit, um das beste Bauteil für Ihre Designanforderungen zu ermitteln.
Intel
EP3SE260F1152C3 - 255K LEs Stratix III E FPGA | Intel / Altera
EP3SE260F1152C3 ⚠ Letzte BestellmöglichkeitSpezifikationsvergleich
| Parameter | EP3SE260H780C3 | EP3SE260F1152C3 |
|---|---|---|
| Marke | Intel | Intel |
| Kategorie | FPGA & CPLD | FPGA & CPLD |
| Lebenszyklusstatus | Aktiv | Letzte Kaufgelegenheit |
| Lagerstatus | In Stock | In Stock |
| Stückpreis (USD) | $1.180,00 | $12.500,00 |
| Device Family | Stratix III Enhanced (Stratix III E) | — |
| Series | EP3SE | Stratix III E |
| Logic Elements | 255,000 | 255,000 |
| Logic Array Blocks (LABs) | 10200 | 10,200 |
| Embedded Memory | 16,672,768 bits (16.67 Mbit) | — |
| User I/Os | 488 | 744 |
| Operating Voltage (Core) | 0.9 V | — |
| Operating Voltage (Auxiliary) | 1.1 V | — |
| Process Technology | 65 nm CMOS | 40 nm |
| Speed Grade | C3 | C3 |
| Betriebstemperatur | Commercial, 0C to +85C | 0C to +85C (Commercial) |
| Maximum Core Frequency | 500 MHz | — |
| Gehäuse | 780-ball FCBGA (HBGA), flip-chip | 1152-ball FCBGA (Flip-Chip BGA) |
| Montageart | Surface Mount (BGA) | Surface Mount |
| Feuchtigkeitsempfindlichkeitsgrad (MSL) | 3 (168 hours) | — |
| Packaging Type | Tray | — |
| Configuration Memory Support | Fast passive parallel, JTAG, Active Serial | — |
| RoHS-Status | Compliant (per product listings) | Compliant |
| Embedded Memory (bits) | — | 16,672,768 |
| Embedded 18x18 Multipliers | — | 384 |
| Core Voltage | — | 0.9 V to 1.1 V |
| Configuration Method | — | Passive Serial / Fast Passive Parallel / JTAG |
| PLLs | — | 12 |