EP3SE260H780C3 vs EP3SE260F1152C3 Comparación
Comparación detallada lado a lado de EP3SE260H780C3 por Intel y EP3SE260F1152C3 por Intel. Compare las especificaciones clave, los parámetros eléctricos, el encapsulado, el estado del ciclo de vida, los precios y la disponibilidad para determinar el mejor componente para los requisitos de su diseño.
Intel
EP3SE260F1152C3 - 255K LEs Stratix III E FPGA | Intel / Altera
EP3SE260F1152C3 ⚠ Última compraComparación de especificaciones
| Parámetro | EP3SE260H780C3 | EP3SE260F1152C3 |
|---|---|---|
| Marca | Intel | Intel |
| Categoría | FPGA & CPLD | FPGA & CPLD |
| Estado del ciclo de vida | Activo | Última compra |
| Estado del stock | In Stock | In Stock |
| Precio unitario (USD) | $1.180,00 | $12.500,00 |
| Device Family | Stratix III Enhanced (Stratix III E) | — |
| Series | EP3SE | Stratix III E |
| Logic Elements | 255,000 | 255,000 |
| Logic Array Blocks (LABs) | 10200 | 10,200 |
| Embedded Memory | 16,672,768 bits (16.67 Mbit) | — |
| User I/Os | 488 | 744 |
| Operating Voltage (Core) | 0.9 V | — |
| Operating Voltage (Auxiliary) | 1.1 V | — |
| Process Technology | 65 nm CMOS | 40 nm |
| Speed Grade | C3 | C3 |
| Temperatura de funcionamiento | Commercial, 0C to +85C | 0C to +85C (Commercial) |
| Maximum Core Frequency | 500 MHz | — |
| Encapsulado | 780-ball FCBGA (HBGA), flip-chip | 1152-ball FCBGA (Flip-Chip BGA) |
| Tipo de montaje | Surface Mount (BGA) | Surface Mount |
| Nivel de sensibilidad a la humedad (MSL) | 3 (168 hours) | — |
| Packaging Type | Tray | — |
| Configuration Memory Support | Fast passive parallel, JTAG, Active Serial | — |
| Estado RoHS | Compliant (per product listings) | Compliant |
| Embedded Memory (bits) | — | 16,672,768 |
| Embedded 18x18 Multipliers | — | 384 |
| Core Voltage | — | 0.9 V to 1.1 V |
| Configuration Method | — | Passive Serial / Fast Passive Parallel / JTAG |
| PLLs | — | 12 |