EP3SL70F484I3 vs EP3SL70F484I4G Comparison
Detailed side-by-side comparison of EP3SL70F484I3 by Intel and EP3SL70F484I4G by Intel. Compare key specifications, electrical parameters, packaging, lifecycle status, pricing, and availability to determine the best component for your design requirements.
Intel
EP3SL70F484I4G - Stratix III L FPGA, 67.5K LE, 484-FBGA | Intel
EP3SL70F484I4G ⚠ Last Time BuySpecification Comparison
| Parameter | EP3SL70F484I3 | EP3SL70F484I4G |
|---|---|---|
| Brand | Intel | Intel |
| Category | FPGA & CPLD | FPGA & CPLD |
| Lifecycle Status | Last Time Buy | Last Time Buy |
| Family | Stratix III L | — |
| Logic Elements | 67,500 | — |
| Adaptive Logic Modules (ALMs) | 33,000 | — |
| Logic Array Blocks (LABs) | 2,700 | — |
| Total Embedded Memory | 2,699,264 bits (337 KB) | — |
| M9K Memory Blocks | 288 | — |
| M144K Memory Blocks | 12 | — |
| DSP Blocks (18x18 multipliers) | 384 | — |
| User I/O Pins | 296 | — |
| Transceivers | Up to 12 (3.75 Gbps) [DATA_NEEDED: confirm exact count for F484 package] | None on this device variant |
| PLLs | 8 (4 enhanced PLLs + 4 fast PLLs) | — |
| Process Node | TSMC 40 nm | — |
| Speed Grade | -3 (mid-tier) | — |
| Operating Temperature | -40C to +100C (industrial) | -40C to +100C (Industrial) |
| Package | 484-ball Flip-Chip BGA (FBGA-484), 1.0 mm pitch | 484-ball FC-FBGA |
| Configuration Modes | FPP, AS, PS, JTAG, AES encryption | — |
| Design Software | Quartus II (legacy) | — |
| RoHS Status | Compliant | Compliant |
| Series | — | Stratix® III L |
| Number of Logic Elements (LE) | — | 67,500 |
| Adaptive Logic Modules (ALM) | — | 27,000 ALM |
| Embedded Memory | — | 2.57 Mbit |
| Number of I/O | — | 296 |
| Number of CLB / LAB | — | 2,700 LAB-equivalent |
| Supply Voltage (Core) | — | 1.1 V |
| DSP Blocks | — | [DATA_NEEDED: DSP block count] |
| PLL Count | — | [DATA_NEEDED: PLL count] |
| Process Technology | — | 65 nm CMOS |
| Mounting Type | — | Surface Mount |
| Maximum Clock Frequency | — | 450 MHz |