EP4CE40U19A7N vs EP4CE40F23C8N Comparison
Detailed side-by-side comparison of EP4CE40U19A7N by Intel and EP4CE40F23C8N by Intel. Compare key specifications, electrical parameters, packaging, lifecycle status, pricing, and availability to determine the best component for your design requirements.
Specification Comparison
| Parameter | EP4CE40U19A7N | EP4CE40F23C8N |
|---|---|---|
| Brand | Intel | Intel |
| Category | FPGA & CPLD | FPGA & CPLD |
| Lifecycle Status | Active | Active |
| Series | Cyclone IV E | — |
| Family | EP4CE40 | Cyclone IV E |
| Logic Elements (LE) | 39,600 | — |
| Embedded Memory (bits) | 1,161,216 (113 Kbytes) | — |
| Embedded Multipliers (18x18) | 116 | — |
| M9K Memory Blocks | 66 | — |
| Maximum User I/O | 328 | 328 |
| PLLs | 4 | 4 |
| Global Clock Networks | 20 | — |
| Package | 484-ball FBGA (U19) | 484-ball FBGA (FineLine BGA), 1.0 mm pitch |
| Grade | Automotive (A7 = -40C to 125C TJ) | — |
| Process Technology | 60 nm low-power CMOS | 60 nm low-power |
| Operating Junction Temperature | -40C to +125C | — |
| Storage Temperature | -65C to +150C | — |
| Configuration Modes | JTAG, Active Serial (AS), Passive Serial (PS), Fast Passive Parallel (FPP) | JTAG, Active Serial (AS), Passive Serial (PS) |
| External Memory Support | DDR/DDR2 SDRAM, QDRII SRAM | — |
| I/O Standards | LVDS, SSTL, HSTL, PCI, LVTTL, LVCMOS | — |
| RoHS Status | Compliant | Compliant |
| Logic Elements | — | 39,600 |
| Logic Array Blocks (LABs) | — | 2,475 |
| Embedded Memory | — | 1,134 Kbit (M9K blocks) |
| Embedded 18x18 Multipliers | — | 66 |
| User I/O Banks | — | 8 |
| Core Voltage | — | 1.2 V |
| Maximum Operating Frequency | — | 200 MHz |
| Mounting Type | — | Surface Mount (BGA) |
| Operating Temperature | — | 0C to +85C (commercial) |
| Lead-Free | — | Yes |