EP4CE55F23I7N vs EP4CE75F23I7N Comparison
Detailed side-by-side comparison of EP4CE55F23I7N by Intel and EP4CE75F23I7N by Intel. Compare key specifications, electrical parameters, packaging, lifecycle status, pricing, and availability to determine the best component for your design requirements.
Specification Comparison
| Parameter | EP4CE55F23I7N | EP4CE75F23I7N |
|---|---|---|
| Brand | Intel | Intel |
| Category | FPGA & CPLD | FPGA & CPLD |
| Lifecycle Status | Active | Active |
| Series | Cyclone IV E | — |
| Logic Elements | 55,856 | — |
| Configurable Logic Blocks (CLBs) | 3,491 | — |
| Embedded Memory | 2,396,160 bits | — |
| Embedded 18x18 Multipliers | 56 | 15 |
| PLLs | 4 | 4 |
| Maximum User I/O | 324 | — |
| Package | 484-ball FBGA (23x23 mm, 1.0 mm pitch) | 484-ball FBGA (F23, 23 mm body, 1.0 mm pitch) |
| Process Technology | TSMC 60 nm low-power | 60 nm low-power CMOS |
| Core Voltage | 1.2 V | — |
| Operating Temperature | -40C to +100C (industrial, I7 grade) | — |
| Mounting Type | Surface Mount (BGA) | — |
| Lead-Free / RoHS | Yes (lead-free finish) | — |
| Configuration Modes | JTAG, AS, PS, FPP | Active Serial (AS), Passive Serial (PS), JTAG |
| Memory Interface Support | DDR, DDR2, QDRII | — |
| Product Line | — | Cyclone IV E |
| Family | — | Cyclone IV E (EP4CE) |
| Logic Elements (LEs) | — | 75,408 |
| Logic Array Blocks (LABs) | — | 4,713 |
| Embedded Memory Bits | — | 2,810,880 bits (312 M9K blocks) |
| Distributed RAM Bits | — | 200 Kbits |
| Global Clocks | — | [DATA_NEEDED: global clock network count] |
| Maximum User I/Os | — | 292 |
| Core Voltage (VCCINT) | — | 1.2 V nominal |
| I/O Voltage (VCCIO) | — | 1.2 V / 1.5 V / 1.8 V / 2.5 V / 3.3 V (per bank) |
| Operating Temperature Grade | — | Industrial (I7: -40C to +100C Tj) |
| External Memory Interfaces | — | DDR / DDR2 SDRAM, QDRII SRAM |
| Design Software | — | Quartus II / Quartus Prime |
| RoHS Status | — | Compliant |