EP4CE6E22C6N vs EP4CE6E22C6 Comparison
Detailed side-by-side comparison of EP4CE6E22C6N by Intel and EP4CE6E22C6 by Intel. Compare key specifications, electrical parameters, packaging, lifecycle status, pricing, and availability to determine the best component for your design requirements.
Specification Comparison
| Parameter | EP4CE6E22C6N | EP4CE6E22C6 |
|---|---|---|
| Brand | Intel | Intel |
| Category | FPGA & CPLD | FPGA & CPLD |
| Lifecycle Status | Active | Active |
| Stock Status | In Stock | In Stock |
| Unit Price (USD) | $11.20 | $12.05 |
| Family | Cyclone IV E | Cyclone IV E |
| Device | EP4CE6 | β |
| Logic Elements (LEs) | 6,272 | β |
| Logic Array Blocks (LABs) | [DATA_NEEDED: LAB count] | 392 LABs |
| Embedded Memory (M9K blocks) | [DATA_NEEDED: M9K block count] | β |
| Embedded Memory (Bits) | 270 Kbits | β |
| Embedded 18x18 Multipliers | 15 | 15 |
| PLLs | 2 | 2 |
| Global Clock Networks | 10 | β |
| Maximum User I/Os | 91 | 91 |
| I/O Banks | 4 | β |
| Process Technology | 60 nm | TSMC 60 nm low-k |
| Core Voltage (VCCINT) | 1.2 V | β |
| I/O Voltage (VCCIO) | 1.2 V / 1.5 V / 1.8 V / 2.5 V / 3.0 V / 3.3 V | β |
| Configuration Modes | JTAG, AS (Active Serial), PS (Passive Serial) | β |
| Package | 144-pin EQFP (Plastic Enhanced QFP, 22 x 22 mm, 0.5 mm pitch) | β |
| Mounting Type | Surface Mount | Surface Mount |
| Operating Temperature | -40 C to +85 C (industrial, C6 speed grade) | 0 Β°C to +85 Β°C (Commercial) |
| RoHS Status | Lead-Free / Compliant | Compliant |
| Lead-Free | Yes | β |
| Device Logic Elements | β | 6,272 LE |
| Total RAM Bits | β | 270 Kbit |
| Core Voltage | β | 1.2 V |
| Speed Grade | β | C6 |
| Package Type | β | 144-pin EQFP (Enhanced QFP, exposed pad) |
| Package Dimensions | β | 22 mm Γ 22 mm |
| Lead Pitch | β | 0.5 mm |
| Configuration Method | β | SRAM-based (volatile); JTAG, Active Serial, Passive Serial |