EP4CE6E22C6N vs EP4CE6E22C6 比較
詳細並排比較 EP4CE6E22C6N 由 Intel 與 EP4CE6E22C6 由 Intel. 比較關鍵規格、電氣參數、封裝、生命週期狀態、價格與供貨情況，以找出最符合您設計需求的元件。
規格比較
| 參數 | EP4CE6E22C6N | EP4CE6E22C6 |
|---|---|---|
| 品牌 | Intel | Intel |
| 類別 | FPGA & CPLD | FPGA & CPLD |
| 生命週期狀態 | 啟用中 | 啟用中 |
| Family | Cyclone IV E | Cyclone IV E |
| Device | EP4CE6 | — |
| Logic Elements (LEs) | 6,272 | — |
| Logic Array Blocks (LABs) | [DATA_NEEDED: LAB count] | 392 LABs |
| Embedded Memory (M9K blocks) | [DATA_NEEDED: M9K block count] | — |
| Embedded Memory (Bits) | 270 Kbits | — |
| Embedded 18x18 Multipliers | 15 | 15 |
| PLLs | 2 | 2 |
| Global Clock Networks | 10 | — |
| Maximum User I/Os | 91 | 91 |
| I/O Banks | 4 | — |
| Process Technology | 60 nm | TSMC 60 nm low-k |
| Core Voltage (VCCINT) | 1.2 V | — |
| I/O Voltage (VCCIO) | 1.2 V / 1.5 V / 1.8 V / 2.5 V / 3.0 V / 3.3 V | — |
| Configuration Modes | JTAG, AS (Active Serial), PS (Passive Serial) | — |
| 封裝 | 144-pin EQFP (Plastic Enhanced QFP, 22 x 22 mm, 0.5 mm pitch) | — |
| 安裝類型 | Surface Mount | Surface Mount |
| 工作溫度 | -40 C to +85 C (industrial, C6 speed grade) | 0 °C to +85 °C (Commercial) |
| RoHS 狀態 | Lead-Free / Compliant | Compliant |
| Lead-Free | Yes | — |
| Device Logic Elements | — | 6,272 LE |
| Total RAM Bits | — | 270 Kbit |
| Core Voltage | — | 1.2 V |
| Speed Grade | — | C6 |
| Package Type | — | 144-pin EQFP (Enhanced QFP, exposed pad) |
| Package Dimensions | — | 22 mm × 22 mm |
| Lead Pitch | — | 0.5 mm |
| Configuration Method | — | SRAM-based (volatile); JTAG, Active Serial, Passive Serial |