EP4CE6E22C6N vs EP4CE6E22C6 Ikinahambing
Detalyadong pagkakahiwalay na pagkakahambing ng EP4CE6E22C6N sa pamamagitan ng Intel at EP4CE6E22C6 sa pamamagitan ng Intel. Ikinahambing ang mga pangunahing paglalarawan, mga tama ng elektriko, paakay, kalagayan ng buhay, presyo, at pagkakaroon upang makita ang pinakamahusay na komponente para sa iyong mga kinakailangang pang disenyo.
Pagsanggunian na paghahambing
| Parametro | EP4CE6E22C6N | EP4CE6E22C6 |
|---|---|---|
| Brand | Intel | Intel |
| Kategorya | FPGA & CPLD | FPGA & CPLD |
| Katayuan ng Lifecycle | Aktibo | Aktibo |
| Family | Cyclone IV E | Cyclone IV E |
| Device | EP4CE6 | — |
| Logic Elements (LEs) | 6,272 | — |
| Logic Array Blocks (LABs) | [DATA_NEEDED: LAB count] | 392 LABs |
| Embedded Memory (M9K blocks) | [DATA_NEEDED: M9K block count] | — |
| Embedded Memory (Bits) | 270 Kbits | — |
| Embedded 18x18 Multipliers | 15 | 15 |
| PLLs | 2 | 2 |
| Global Clock Networks | 10 | — |
| Maximum User I/Os | 91 | 91 |
| I/O Banks | 4 | — |
| Process Technology | 60 nm | TSMC 60 nm low-k |
| Core Voltage (VCCINT) | 1.2 V | — |
| I/O Voltage (VCCIO) | 1.2 V / 1.5 V / 1.8 V / 2.5 V / 3.0 V / 3.3 V | — |
| Configuration Modes | JTAG, AS (Active Serial), PS (Passive Serial) | — |
| Packhaging | 144-pin EQFP (Plastic Enhanced QFP, 22 x 22 mm, 0.5 mm pitch) | — |
| Uri ng Pagpapasok | Surface Mount | Surface Mount |
| Temperature na Operasyon | -40 C to +85 C (industrial, C6 speed grade) | 0 °C to +85 °C (Commercial) |
| Tindminan RoHS | Lead-Free / Compliant | Compliant |
| Lead-Free | Yes | — |
| Device Logic Elements | — | 6,272 LE |
| Total RAM Bits | — | 270 Kbit |
| Core Voltage | — | 1.2 V |
| Speed Grade | — | C6 |
| Package Type | — | 144-pin EQFP (Enhanced QFP, exposed pad) |
| Package Dimensions | — | 22 mm × 22 mm |
| Lead Pitch | — | 0.5 mm |
| Configuration Method | — | SRAM-based (volatile); JTAG, Active Serial, Passive Serial |