EP4CE6E22I7N vs EP4CE6E22C6 Ikinahambing

Detalyadong pagkakahiwalay na pagkakahambing ng EP4CE6E22I7N sa pamamagitan ng Intel at EP4CE6E22C6 sa pamamagitan ng Intel. Ikinahambing ang mga pangunahing paglalarawan, mga tama ng elektriko, paakay, kalagayan ng buhay, presyo, at pagkakaroon upang makita ang pinakamahusay na komponente para sa iyong mga kinakailangang pang disenyo.

Pagsanggunian na paghahambing

Parametro EP4CE6E22I7N EP4CE6E22C6
Brand Intel Intel
Kategorya FPGA & CPLD FPGA & CPLD
Katayuan ng Lifecycle Aktibo Aktibo
Family Cyclone IV E Cyclone IV E
Logic Elements (LEs) 6,272 —
Configurable Logic Blocks (CLBs) 392 —
Embedded Memory (RAM) 270 Kbits —
User Flash Memory 4 Kbits —
User I/O Pins 91 —
PLLs (General-Purpose) 2 —
Global Clock Networks Up to 20 —
Process Technology 60 nm (TSMC low-power) TSMC 60 nm low-k
Core Voltage (VCCINT) 1.0 V to 1.2 V (nominal 1.2 V) —
Operating Temperature (I7 grade) -40C to +100C (junction) —
Maximum Operating Frequency Up to 472.5 MHz —
Packhaging 144-pin EQFP (Plastic Enhanced QFP) with exposed pad —
Uri ng Pagpapasok Surface Mount Surface Mount
Configuration Method Serial (EPCS) or JTAG SRAM-based (volatile); JTAG, Active Serial, Passive Serial
Supported I/O Standards LVDS, LVTTL, LVCMOS, SSTL, HSTL —
Level ng MSL 3 (per JEDEC J-STD-020) —
Tindminan RoHS Compliant Compliant
Device Logic Elements — 6,272 LE
Logic Array Blocks (LABs) — 392 LABs
Total RAM Bits — 270 Kbit
Embedded 18x18 Multipliers — 15
PLLs — 2
Maximum User I/Os — 91
Core Voltage — 1.2 V
Speed Grade — C6
Temperature na Operasyon — 0 °C to +85 °C (Commercial)
Package Type — 144-pin EQFP (Enhanced QFP, exposed pad)
Package Dimensions — 22 mm × 22 mm
Lead Pitch — 0.5 mm

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