EP4CE6E22I7N vs EP4CE6E22C6 Perbandingan
Perbandingan bersamaan detil EP4CE6E22I7N dari Intel dan EP4CE6E22C6 dari Intel. Bandingkan spesifikasi penting, parameter listrik, pengemasan, status cycle, harga, dan ketersediaan untuk menentukan komponen terbaik untuk kebutuhan desain Anda.
Perbandingan Spesifikasi
| Parameter Umum | EP4CE6E22I7N | EP4CE6E22C6 |
|---|---|---|
| Merek | Intel | Intel |
| Kategori | FPGA & CPLD | FPGA & CPLD |
| Status Lingkungan Hidup | Aktif | Aktif |
| Family | Cyclone IV E | Cyclone IV E |
| Logic Elements (LEs) | 6,272 | — |
| Configurable Logic Blocks (CLBs) | 392 | — |
| Embedded Memory (RAM) | 270 Kbits | — |
| User Flash Memory | 4 Kbits | — |
| User I/O Pins | 91 | — |
| PLLs (General-Purpose) | 2 | — |
| Global Clock Networks | Up to 20 | — |
| Process Technology | 60 nm (TSMC low-power) | TSMC 60 nm low-k |
| Core Voltage (VCCINT) | 1.0 V to 1.2 V (nominal 1.2 V) | — |
| Operating Temperature (I7 grade) | -40C to +100C (junction) | — |
| Maximum Operating Frequency | Up to 472.5 MHz | — |
| Paket | 144-pin EQFP (Plastic Enhanced QFP) with exposed pad | — |
| Tipe Mounting | Surface Mount | Surface Mount |
| Configuration Method | Serial (EPCS) or JTAG | SRAM-based (volatile); JTAG, Active Serial, Passive Serial |
| Supported I/O Standards | LVDS, LVTTL, LVCMOS, SSTL, HSTL | — |
| Level MSL | 3 (per JEDEC J-STD-020) | — |
| Status RoHS | Compliant | Compliant |
| Device Logic Elements | — | 6,272 LE |
| Logic Array Blocks (LABs) | — | 392 LABs |
| Total RAM Bits | — | 270 Kbit |
| Embedded 18x18 Multipliers | — | 15 |
| PLLs | — | 2 |
| Maximum User I/Os | — | 91 |
| Core Voltage | — | 1.2 V |
| Speed Grade | — | C6 |
| Suhu Kerja | — | 0 °C to +85 °C (Commercial) |
| Package Type | — | 144-pin EQFP (Enhanced QFP, exposed pad) |
| Package Dimensions | — | 22 mm × 22 mm |
| Lead Pitch | — | 0.5 mm |