EP4CGX110CF23C8N vs EP4CGX110DF23I7N Comparison

Detailed side-by-side comparison of EP4CGX110CF23C8N by Intel and EP4CGX110DF23I7N by Intel. Compare key specifications, electrical parameters, packaging, lifecycle status, pricing, and availability to determine the best component for your design requirements.

Specification Comparison

Parameter EP4CGX110CF23C8N EP4CGX110DF23I7N
Brand Intel Intel
Category FPGA & CPLD FPGA & CPLD
Lifecycle Status Active Active
Family Cyclone IV GX Cyclone IV GX
Logic Elements 109,424 109,424
Logic Array Blocks (LABs) 6,839 6,839
Embedded Memory (bits) 5,621,760 —
User I/O Count 270 —
Transceivers 4 channels Up to 3.125 Gbps embedded transceivers
Transceiver Data Rate (max) 3.125 Gbps —
DSP Blocks (18x18 multipliers) [DATA_NEEDED: DSP block count] —
Process Node 60 nm —
Core Voltage 1.2 V —
Speed Grade C8 7
Operating Temperature 0 C to 85 C (commercial) -40C to +100C (industrial)
Package 484-ball FBGA (F23) 484-ball FBGA, 23 x 23 mm, 1.00 mm pitch
Mounting Type Surface Mount (BGA) Surface Mount
RoHS Status Compliant Compliant
Lead-Free Yes —
MSL Level 3 —
Configuration Method Quartus Prime / JTAG / Active Serial —
User I/O Pins — 270
Embedded Memory — 4.4 Mbits (approximate)
Embedded 18x18 Multipliers — 56
Core Supply Voltage (VCCINT) — 1.15 V to 1.25 V (nominal 1.2 V)
Process Technology — 60 nm low-power CMOS
Package Code — BGA (FBGA)
Configuration Memory — SRAM-based (volatile, requires external config device)

Datasheets & Resources

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