EP4CGX110CF23C8N vs EP4CGX110DF23I7N Comparación
Comparación detallada lado a lado de EP4CGX110CF23C8N por Intel y EP4CGX110DF23I7N por Intel. Compare las especificaciones clave, los parámetros eléctricos, el encapsulado, el estado del ciclo de vida, los precios y la disponibilidad para determinar el mejor componente para los requisitos de su diseño.
Comparación de especificaciones
| Parámetro | EP4CGX110CF23C8N | EP4CGX110DF23I7N |
|---|---|---|
| Marca | Intel | Intel |
| Categoría | FPGA & CPLD | FPGA & CPLD |
| Estado del ciclo de vida | Activo | Activo |
| Estado del stock | In Stock | In Stock |
| Precio unitario (USD) | $170,45 | $182,00 |
| Family | Cyclone IV GX | Cyclone IV GX |
| Logic Elements | 109,424 | 109,424 |
| Logic Array Blocks (LABs) | 6,839 | 6,839 |
| Embedded Memory (bits) | 5,621,760 | — |
| User I/O Count | 270 | — |
| Transceivers | 4 channels | Up to 3.125 Gbps embedded transceivers |
| Transceiver Data Rate (max) | 3.125 Gbps | — |
| DSP Blocks (18x18 multipliers) | [DATA_NEEDED: DSP block count] | — |
| Process Node | 60 nm | — |
| Core Voltage | 1.2 V | — |
| Speed Grade | C8 | 7 |
| Temperatura de funcionamiento | 0 C to 85 C (commercial) | -40C to +100C (industrial) |
| Encapsulado | 484-ball FBGA (F23) | 484-ball FBGA, 23 x 23 mm, 1.00 mm pitch |
| Tipo de montaje | Surface Mount (BGA) | Surface Mount |
| Estado RoHS | Compliant | Compliant |
| Lead-Free | Yes | — |
| Nivel MSL | 3 | — |
| Configuration Method | Quartus Prime / JTAG / Active Serial | — |
| User I/O Pins | — | 270 |
| Embedded Memory | — | 4.4 Mbits (approximate) |
| Embedded 18x18 Multipliers | — | 56 |
| Core Supply Voltage (VCCINT) | — | 1.15 V to 1.25 V (nominal 1.2 V) |
| Process Technology | — | 60 nm low-power CMOS |
| Package Code | — | BGA (FBGA) |
| Configuration Memory | — | SRAM-based (volatile, requires external config device) |